EP3CLS100F780I7N

The EP3CLS100F780I7N is an Intel Cyclone III family FPGA designed for low-power, cost-sensitive system designs that require substantial programmable logic and on-chip memory. This device provides 100,448 logic elements and approximately 4.45 Mbits of embedded memory, making it suitable for high-density logic integration and mid-range system-on-chip tasks.

Built for rugged environments, the device is specified for industrial operation from −40 °C to 100 °C, features a 780-ball FBGA package (29 × 29 mm), and supports a core voltage range of 1.15 V to 1.25 V. With 413 I/O pins and surface-mount packaging, it targets applications that need a balance of integration, I/O capacity, and low-power operation.

Key Features

• Core Logic — 100,448 logic elements for implementing large, complex designs and high integration of custom logic functions.
• Embedded Memory — Approximately 4.45 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive functions without external RAM.
• I/O Capacity — 413 user I/Os to support multiple parallel interfaces, sensors, and high-density connectivity requirements.
• Power and Voltage — Core supply defined between 1.15 V and 1.25 V; part of the Cyclone III family engineered for low-power operation.
• Package and Mounting — 780-ball FBGA (29 × 29 mm) package in a surface-mount form factor for compact, high-pin-count board layouts.
• Operating Temperature — Industrial temperature grade from −40 °C to 100 °C for reliable operation in thermally challenging environments.
• Standards and Compliance — RoHS compliant to support modern environmental requirements.
• Cyclone III Family Capabilities — Family-level features include low-power TSMC LP process optimizations, a rich IP ecosystem, and architecture options that scale from small to high-density devices.

Typical Applications

• Industrial Control — Implement motor control logic, sensor aggregation, and deterministic I/O handling in industrial systems that require an extended temperature range and robust I/O counts.
• Communications and Networking — Use as protocol bridging, packet buffering, and custom interface logic where large logic capacity and plentiful I/Os enable flexible system design.
• Instrumentation and Test Equipment — Leverage substantial embedded memory and dense logic for data acquisition, signal processing, and real-time control functions.
• Portable and Battery-Powered Systems — Benefit from Cyclone III family low-power characteristics to extend battery life in portable or handheld devices while maintaining high logic capacity.

Unique Advantages

• High Logic Density: 100,448 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level complexity.
• Significant On-Chip RAM: Approximately 4.45 Mbits of embedded memory reduces dependence on external memory, simplifying BOM and PCB routing.
• Large I/O Count: 413 I/Os provide flexibility for multi-channel interfaces, parallel peripherals, and expansion headers.
• Industrial Temperature Range: Specified −40 °C to 100 °C for deployment in demanding environments where temperature resilience matters.
• Compact, High-Pin Package: 780-FBGA (29 × 29 mm) package supports high I/O density in space-constrained designs.
• Environmentally Compliant: RoHS compliance supports regulatory and corporate sustainability requirements.

Why Choose EP3CLS100F780I7N?

The EP3CLS100F780I7N brings a balance of high logic capacity, on-chip memory, and extensive I/O in a package designed for industrial temperature operation. It is well suited to customers who need to consolidate complex functionality into a single programmable device while maintaining power efficiency and robust thermal performance.

As a member of the Cyclone III family, it benefits from the family’s low-power process optimizations and broad IP support, providing a scalable platform for mid- to high-density programmable logic designs and long-term design viability.

If you need a quote or more information about integrating the EP3CLS100F780I7N into your design, submit a request for pricing or a formal quote today.