EP3CLS100U484C8
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 278 4451328 100448 484-FBGA |
|---|---|
| Quantity | 1,386 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-UBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-FBGA | Number of I/O | 278 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6278 | Number of Logic Elements/Cells | 100448 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4451328 |
Overview of EP3CLS100U484C8 – Cyclone® III FPGA, 100,448 logic elements, 484-FBGA
The EP3CLS100U484C8 is a Cyclone® III field programmable gate array (FPGA) from Intel, designed for low-power, cost-sensitive, high-functionality designs. This device combines a large logic fabric with embedded memory and a high I/O count to support system integration in compact surface-mount packages.
With 100,448 logic elements and approximately 4.45 Mbits of embedded memory, the device is suited to applications that require significant programmable logic, abundant I/O, and efficient power usage. The device operates from a 1.15 V to 1.25 V supply and is specified for commercial temperature ranges (0 °C to 85 °C).
Key Features
- Logic Capacity Provides 100,448 logic elements to implement complex custom logic, datapaths, and control functions.
- Embedded Memory Approximately 4.45 Mbits of on-chip RAM for buffering, lookup tables, and local storage without external memory.
- I/O Resources 278 user I/Os delivered in a 484-FBGA package, enabling rich peripheral interfacing and board-level integration.
- Clock Management Cyclone III family devices include multiple phase-locked loops (PLLs) for robust clock synthesis and distribution (family-level feature).
- Low-Power Silicon Built on a low-power process with family-level static power consumption under approximately 0.25 W, helping to meet conservative power budgets.
- Package & Mounting 484-FBGA (484-UBGA, 19×19) surface-mount package for dense board designs and reliable assembly.
- Supply & Temperature Specified supply range of 1.15 V to 1.25 V and commercial operating temperature from 0 °C to 85 °C.
- RoHS Compliant Meets RoHS requirements for lead-free assembly and environmental compliance.
Typical Applications
- Portable and Handheld Devices Low static power and compact FBGA packaging make the device appropriate for battery-powered and space-constrained equipment.
- Embedded Control and Signal Processing Large logic capacity and on-chip RAM support custom control logic, protocol handling, and mid-range signal processing tasks.
- High-Volume Consumer Electronics Designed for cost-sensitive, high-volume designs where integration and low power are priorities.
- Custom I/O Interfaces High I/O count enables implementation of diverse peripheral interfaces and board-level integration without large external glue logic.
Unique Advantages
- High Logic Density: 100,448 logic elements let designers consolidate multiple functions onto a single device, reducing board complexity.
- On-chip Memory: Approximately 4.45 Mbits of embedded RAM reduces dependence on external memory, simplifying BOM and layout.
- Rich I/O in Compact Package: 278 I/Os in a 484-FBGA footprint allow extensive peripheral connectivity while keeping board area small.
- Power-Efficient Architecture: Low-power process and family-level static power below ~0.25 W help meet energy and thermal constraints in portable systems.
- Proven FPGA Ecosystem: Cyclone III family-level features include PLLs, embedded processor support, and pre-built IP to accelerate development and integration.
- Compliance and Assembly: RoHS compliance and surface-mount 484-UBGA packaging facilitate modern manufacturing and regulatory requirements.
Why Choose EP3CLS100U484C8?
The EP3CLS100U484C8 positions itself as a scalable, power-conscious FPGA option for designers who need large programmable logic capacity, substantial embedded memory, and a high I/O count in a compact surface-mount package. Its Cyclone III family heritage delivers low-power silicon, clock management features, and an established IP and tool ecosystem to help shorten development cycles.
This device is particularly well suited for customers building cost-sensitive, high-volume products or space- and power-constrained systems that require significant on-chip logic and memory. Commercial-temperature rating and RoHS compliance simplify integration into mainstream electronics platforms.
Request a quote or submit an inquiry to evaluate availability and begin integrating the EP3CLS100U484C8 into your design.

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