EP3CLS100U484C8

IC FPGA 278 I/O 484UBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 278 4451328 100448 484-FBGA

Quantity 1,386 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-FBGANumber of I/O278Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6278Number of Logic Elements/Cells100448
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4451328

Overview of EP3CLS100U484C8 – Cyclone® III FPGA, 100,448 logic elements, 484-FBGA

The EP3CLS100U484C8 is a Cyclone® III field programmable gate array (FPGA) from Intel, designed for low-power, cost-sensitive, high-functionality designs. This device combines a large logic fabric with embedded memory and a high I/O count to support system integration in compact surface-mount packages.

With 100,448 logic elements and approximately 4.45 Mbits of embedded memory, the device is suited to applications that require significant programmable logic, abundant I/O, and efficient power usage. The device operates from a 1.15 V to 1.25 V supply and is specified for commercial temperature ranges (0 °C to 85 °C).

Key Features

  • Logic Capacity  Provides 100,448 logic elements to implement complex custom logic, datapaths, and control functions.
  • Embedded Memory  Approximately 4.45 Mbits of on-chip RAM for buffering, lookup tables, and local storage without external memory.
  • I/O Resources  278 user I/Os delivered in a 484-FBGA package, enabling rich peripheral interfacing and board-level integration.
  • Clock Management  Cyclone III family devices include multiple phase-locked loops (PLLs) for robust clock synthesis and distribution (family-level feature).
  • Low-Power Silicon  Built on a low-power process with family-level static power consumption under approximately 0.25 W, helping to meet conservative power budgets.
  • Package & Mounting  484-FBGA (484-UBGA, 19×19) surface-mount package for dense board designs and reliable assembly.
  • Supply & Temperature  Specified supply range of 1.15 V to 1.25 V and commercial operating temperature from 0 °C to 85 °C.
  • RoHS Compliant  Meets RoHS requirements for lead-free assembly and environmental compliance.

Typical Applications

  • Portable and Handheld Devices  Low static power and compact FBGA packaging make the device appropriate for battery-powered and space-constrained equipment.
  • Embedded Control and Signal Processing  Large logic capacity and on-chip RAM support custom control logic, protocol handling, and mid-range signal processing tasks.
  • High-Volume Consumer Electronics  Designed for cost-sensitive, high-volume designs where integration and low power are priorities.
  • Custom I/O Interfaces  High I/O count enables implementation of diverse peripheral interfaces and board-level integration without large external glue logic.

Unique Advantages

  • High Logic Density:  100,448 logic elements let designers consolidate multiple functions onto a single device, reducing board complexity.
  • On-chip Memory:  Approximately 4.45 Mbits of embedded RAM reduces dependence on external memory, simplifying BOM and layout.
  • Rich I/O in Compact Package:  278 I/Os in a 484-FBGA footprint allow extensive peripheral connectivity while keeping board area small.
  • Power-Efficient Architecture:  Low-power process and family-level static power below ~0.25 W help meet energy and thermal constraints in portable systems.
  • Proven FPGA Ecosystem:  Cyclone III family-level features include PLLs, embedded processor support, and pre-built IP to accelerate development and integration.
  • Compliance and Assembly:  RoHS compliance and surface-mount 484-UBGA packaging facilitate modern manufacturing and regulatory requirements.

Why Choose EP3CLS100U484C8?

The EP3CLS100U484C8 positions itself as a scalable, power-conscious FPGA option for designers who need large programmable logic capacity, substantial embedded memory, and a high I/O count in a compact surface-mount package. Its Cyclone III family heritage delivers low-power silicon, clock management features, and an established IP and tool ecosystem to help shorten development cycles.

This device is particularly well suited for customers building cost-sensitive, high-volume products or space- and power-constrained systems that require significant on-chip logic and memory. Commercial-temperature rating and RoHS compliance simplify integration into mainstream electronics platforms.

Request a quote or submit an inquiry to evaluate availability and begin integrating the EP3CLS100U484C8 into your design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up