EP3CLS100F780I7

The EP3CLS100F780I7 is a Cyclone III family FPGA from Intel, delivered in a 780-ball FBGA (29 × 29) package and specified for industrial operation. This device combines a large programmable fabric—100,448 logic elements—with approximately 4.45 Mbits of embedded memory and 413 user I/Os to address high-volume, low-power, and cost-sensitive applications.

Designed for surface-mount assembly, the device operates from a core supply of 1.15 V to 1.25 V and is rated for an operating temperature range of −40 °C to 100 °C. It is RoHS compliant.

Key Features

• Logic Capacity — 100,448 logic elements for substantial on-chip programmable logic resources.
• Embedded Memory — Approximately 4.45 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic.
• I/O Density — 413 user I/O pins suitable for complex interfacing and high-pin-count system designs.
• Power Supply — Core supply range of 1.15 V to 1.25 V to match targeted low-power system designs.
• Package & Mounting — 780-FBGA (29 × 29) package, surface-mount, providing a compact high-pin-count form factor.
• Industrial Temperature Grade — Qualified for −40 °C to 100 °C operation for use in thermally demanding environments.
• Regulatory — RoHS compliant for environmental and manufacturing compliance.

Typical Applications

• Embedded Systems — Implements custom logic and accelerators where large logic capacity and on-chip memory reduce external BOM and latency.
• Industrial Control — Processes sensor data and drives control logic across a wide operating temperature range for robust industrial equipment.
• Communications & I/O Aggregation — Aggregates and translates high pin-count I/O for data routing, protocol bridging, and interface consolidation.
• Low-Power, High-Volume Products — Suited to cost-sensitive, volume applications that require low static power and scalable programmable logic.

Unique Advantages

• Large, Ready-to-Use Logic Fabric: 100,448 logic elements enable substantial on-chip implementation of custom logic, reducing reliance on external components.
• Significant On-Chip Memory: Approximately 4.45 Mbits of embedded RAM supports buffering, look-up tables, and state machines without external memory.
• High I/O Count: 413 I/Os give designers flexibility to connect sensors, peripherals, and high-density interfaces directly to the FPGA.
• Industrial Temperature Range: Specified −40 °C to 100 °C for deployment in demanding thermal environments.
• Compact High-Pin Package: 780-FBGA (29 × 29) package balances pin count with PCB footprint for dense board designs.
• Environmentally Compliant: RoHS status simplifies regulatory compliance for manufacturing and distribution.

Why Choose EP3CLS100F780I7?

The EP3CLS100F780I7 positions itself as a high-capacity Cyclone III FPGA option for designers who need a balance of large programmable resources, significant embedded memory, and a high I/O count in an industrial-grade package. Its electrical and thermal specifications make it suitable for systems that require robust operation across a wide temperature range while maintaining low-power characteristics at the core supply level.

Choose this device when your design requires substantial on-chip logic and memory integration to reduce BOM, shorten signal paths, and centralize system functions in a single, RoHS-compliant FPGA package backed by the Cyclone III device family features.

Request a quote or submit a purchase inquiry today to learn availability and pricing for EP3CLS100F780I7.