EP3CLS100F780C7

The EP3CLS100F780C7 is a Cyclone III family FPGA optimized for low-power, high-functionality applications. It combines a large logic fabric with substantial on-chip memory and a high pin count to support complex, I/O-rich designs in commercial-temperature environments.

Built on the Cyclone III device family, this device targets cost- and power-sensitive systems that require flexible logic, on-chip memory, and robust clock management while maintaining a low-voltage core supply.

Key Features

• Logic Capacity — 100,448 logic elements provide a large programmable fabric for complex digital designs.
• Embedded Memory — Approximately 4.45 Mbits of on-chip RAM to support buffering, state storage, and data-intensive functions.
• I/O Density — 413 user I/Os to interface with multiple peripherals and high-pin-count systems.
• Clock Management — Cyclone III family architecture includes up to four phase-locked loops (PLLs) for flexible clock synthesis and distribution.
• Low-Voltage Core — Core supply range of 1.15 V to 1.25 V to enable low-power operation consistent with Cyclone III low-power process optimizations.
• Package — 780-ball BGA in a 29×29 FBGA footprint, designed for surface-mount assembly and dense PCB integration.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Standards & I/O Flexibility — Cyclone III family supports a wide set of I/O standards and on-chip termination calibration to simplify signal integrity across PVT conditions.
• Compliance — RoHS compliant.

Typical Applications

• Battery-powered and portable devices — Low-power family characteristics help extend battery life in handheld and portable systems.
• I/O‑intensive systems — High I/O count supports applications requiring many external interfaces or complex board-level integration.
• Embedded logic and memory consolidation — Large logic capacity combined with approximately 4.45 Mbits of embedded memory enables consolidation of glue logic and mid-size data buffering on a single device.
• Clocked systems and interfaces — On-chip PLLs support clock generation and distribution for multi-domain timing and interface requirements.

Unique Advantages

• High-density programmable fabric: 100,448 logic elements let you implement large custom digital blocks without external CPLDs or discrete logic.
• Significant on-chip memory: Approximately 4.45 Mbits of embedded RAM reduces the need for external memory in many buffering and state-storage use cases.
• Large I/O capability: 413 I/Os enable broad system integration and support for multiple parallel interfaces.
• Low-voltage core operation: 1.15 V to 1.25 V core supply contributes to reduced power consumption and thermal load.
• Compact, surface-mount package: 780-BGA (29×29 FBGA) balances high pin count with a compact board footprint for dense PCB designs.
• Commercial temperature suitability: Rated 0 °C to 85 °C for mainstream electronic products and systems.

Why Choose EP3CLS100F780C7?

The EP3CLS100F780C7 places a large Cyclone III FPGA fabric, substantial embedded memory, and a high I/O count into a compact 780-BGA footprint. Its low-voltage core and family-level low-power architecture make it well suited to cost- and power-sensitive commercial designs that need significant programmable logic and on-chip resources.

This device is a fit for engineering teams consolidating system logic, implementing complex I/O interfaces, or deploying mid-density embedded memory solutions while leveraging the Cyclone III ecosystem for clock management and interface flexibility.

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