EP3CLS100F484C8N

The EP3CLS100F484C8N is a Cyclone® III family field-programmable gate array packaged in a 484-ball BGA (23 × 23) surface-mount package. It delivers high logic capacity and on-chip memory for cost-sensitive, low-power commercial designs that require extensive I/O and flexible system integration.

With 100,448 logic elements and approximately 4.45 Mbits of embedded memory, this device is suited to applications that need a balance of density, on-chip resources, and configurable I/O in a compact BGA footprint.

Key Features

• Logic Capacity  100,448 logic elements and 6,278 logic blocks for implementing complex, highly parallel logic and control functions.
• Embedded Memory  Approximately 4.45 Mbits of on-chip RAM to support buffering, state machines, and small data sets without external memory.
• I/O Resources  278 general-purpose I/Os to support extensive peripheral, sensor, and interface connectivity on a single device.
• Power Supply  Core voltage range of 1.15 V to 1.25 V to match system power rails and enable low-power operation.
• Package & Mounting  484-BGA (484-FBGA, 23×23) surface-mount package for high-density PCB designs and robust board-level integration.
• Operating Range  Commercial-grade operating temperature from 0 °C to 85 °C, suitable for mainstream electronics and embedded products.
• RoHS Compliance  RoHS-compliant construction to meet environmental and manufacturing requirements.
• Cyclone III Family Capabilities  Device family features include low-power process optimizations, clock management with multiple PLLs, and a high memory-to-logic ratio for system-level integration and reduced external component count.

Typical Applications

• Consumer & Portable Electronics  Implement user interfaces, sensor aggregation, and custom peripheral control while keeping power and BOM cost low.
• Industrial Control  Serve as a compact configurable controller for motor control, machine I/O aggregation, and protocol bridging where a commercial-grade temperature range is acceptable.
• Communications & Networking  Handle interface logic, packet buffering, and custom timing/clocking functions with plentiful I/Os and embedded RAM.
• Embedded Systems  Provide glue logic, finite-state machines, and on-chip processing support in systems that benefit from reconfigurability and in-field updates.

Unique Advantages

• High Logic Density:  100,448 logic elements enable substantial on-chip integration, reducing the need for multiple discrete devices.
• Substantial On-Chip Memory:  Approximately 4.45 Mbits of embedded RAM supports local buffering and state storage to simplify board-level memory architecture.
• Extensive I/O Count:  278 I/Os provide flexibility for complex interfacing requirements and help consolidate system functions onto one FPGA.
• Compact BGA Package:  484-ball FBGA (23×23) combines high pin count with a compact footprint for space-constrained PCBs.
• Low-Voltage Core Operation:  1.15 V to 1.25 V core supply supports low-power system designs and aligns with modern power delivery schemes.
• Designed for Low Power:  Cyclone III family optimizations target reduced static power, helping meet power budgets in portable and thermally constrained applications.

Why Choose EP3CLS100F484C8N?

EP3CLS100F484C8N positions itself as a high-capacity, commercially graded Cyclone III FPGA designed to consolidate logic, memory, and I/O in a single, RoHS-compliant package. Its combination of 100,448 logic elements, significant embedded RAM, and 278 I/Os makes it a practical choice for designers seeking to reduce board-level complexity while maintaining reconfigurability.

This device is well suited to engineering teams building cost-sensitive, low-power products that require scalable logic resources and flexible interfacing. Leveraging Cyclone III family capabilities for on-chip clock management and system integration can shorten development cycles and simplify BOMs for volume production.

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