EP3C80U484I7N

The EP3C80U484I7N is a Cyclone® III family FPGA optimized for low-power, high-functionality designs. It integrates programmable logic, embedded memory, and high I/O density in a compact 484-FBGA package to address high-volume, cost-sensitive applications.

Built on the Cyclone III device architecture, this industrial-grade FPGA targets designs that require a balance of logic capacity, on-chip memory, and flexible I/O while operating across a wide temperature and supply range.

Key Features

• Logic Capacity — 81,264 logic elements and 5,079 logic array blocks (LABs) provide ample programmable logic for medium- to high-complexity designs.
• Embedded Memory — Approximately 2.81 Mbits of on-chip RAM supports buffering, packet processing, and small data tables without external memory.
• I/O Density — 295 user I/Os enable broad peripheral connectivity and board-level interfacing flexibility.
• Clock Management — Cyclone III family features (as documented for the device family) include multiple phase-locked loops (PLLs) for robust clock synthesis and distribution.
• Low-Power Architecture — Family-level low-power process and silicon optimizations reduce static power consumption, helpful for battery-powered and thermally constrained designs.
• Package and Mounting — 484-FBGA (supplier package 484-UBGA, 19×19) in a surface-mount form factor simplifies PCB layout for dense systems.
• Voltage and Temperature — Core supply range 1.15 V to 1.25 V and industrial operating temperature from −40 °C to 100 °C for robust operation in demanding environments.
• System Integration Features — Family-level features include high memory-to-logic and multiplier-to-logic ratios, adjustable I/O slew rates, and support for multiple common I/O standards to ease system design.
• RoHS Compliance — Meets RoHS environmental requirements.

Typical Applications

• Portable and Handheld Devices — Low-power Cyclone III architecture and compact 484-FBGA package make the device suitable for battery-powered equipment where power and board area are constrained.
• Industrial Control and Automation — Industrial-grade temperature range (−40 °C to 100 °C) and abundant I/Os support sensor interfacing, motor control logic, and factory-floor systems.
• Embedded Processing and System Integration — On-chip memory and logic capacity support embedded processing tasks and integration of IP cores for control and data-path functions.
• Communications and Interface Bridging — High I/O count and clock management capabilities enable protocol bridging, interface adaptation, and system timing tasks.

Unique Advantages

• Balanced Logic and Memory — 81,264 logic elements paired with approximately 2.81 Mbits of embedded memory helps implement control logic and local data buffering without excessive external components.
• High I/O Count — 295 user I/Os provide flexibility to connect multiple peripherals, sensors, and interfaces directly to the FPGA.
• Industrial Robustness — Rated for −40 °C to 100 °C operation, suitable for harsh environmental deployments common in industrial applications.
• Compact, PCB-Friendly Package — 484-FBGA (19×19 UBGA) surface-mount package enables dense PCB layouts while maintaining thermal and signal integrity.
• Power-Efficient Architecture — Cyclone III family design and low-power process technology reduce static power, benefiting thermally constrained and battery-operated products.
• Design Ecosystem Support — Family-level documentation and available IP (including embedded processor options) support faster integration and verification in system designs.

Why Choose EP3C80U484I7N?

The EP3C80U484I7N delivers a practical mix of logic capacity, embedded memory, and high I/O count in an industrial-grade FPGA package. Its Cyclone III architecture targets cost-sensitive, low-power applications that still require significant on-chip resources and flexible clocking.

This part is suitable for engineers and procurement teams building mid-to-high complexity embedded systems, industrial controllers, or portable devices that demand reliable operation across a wide temperature range and a compact board footprint. The combination of on-chip resources and family-level integration features supports scalable designs and simplified system architecture.

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