EP3C80U484C8

The EP3C80U484C8 is a Cyclone® III family field programmable gate array (FPGA) in a 484‑FBGA package, delivering 81,264 logic elements and approximately 2.81 Mbits of embedded memory. Designed for high‑volume, low‑power and cost‑sensitive applications, the Cyclone III family combines silicon optimizations and power‑aware design features to reduce static power consumption while providing significant system integration.

This commercial‑grade, surface‑mount device offers a dense I/O count and flexible power envelope, making it suitable for compact embedded systems and portable products that require configurable logic, on‑chip memory, and broad I/O capability.

Key Features

• Logic Capacity  Provides 81,264 logic elements for implementing complex custom logic and glue functions.
• Embedded Memory  Approximately 2.81 Mbits of on‑chip RAM to support buffering, state storage, and soft‑processor data needs.
• I/O Density  295 user I/Os to support multiple interfaces and peripheral connections in a single device footprint.
• Power and Voltage  Operates from a core supply of 1.15 V to 1.25 V, leveraging the Cyclone III family’s low‑power process optimizations.
• Package and Mounting  484‑FBGA (supplier package: 484‑UBGA, 19×19) surface‑mount package for high‑density PCB integration.
• Commercial Grade and Temperature  Rated for commercial operation from 0 °C to 85 °C.
• Standards and Compliance  RoHS compliant to meet environmental and manufacturing requirements.
• Cyclone III Family Features  Family capabilities include low‑power operation and device‑level clock management features such as multiple PLLs for robust clock synthesis and distribution (family characteristic).

Typical Applications

• Portable and Handheld Devices  Low‑power characteristics and compact FBGA packaging suit battery‑powered instruments and handheld electronics.
• Consumer and Multimedia Systems  High logic and memory capacity enable custom data handling, pre‑processing, and control functions in consumer devices.
• Embedded Control and Signal Glue  Large I/O count and programmable logic make it effective for system glue logic, protocol bridging, and hardware offload tasks.
• High‑volume, Cost‑sensitive Products  Engineered for low cost and low static power for applications where unit cost and power budget are primary constraints.

Unique Advantages

• High Integration  Combines 81,264 logic elements, substantial embedded RAM, and 295 I/Os in one package to reduce BOM and simplify board design.
• Low‑Power Silicon  Based on a low‑power process and power‑aware family design, helping extend battery life and lower cooling requirements in deployed systems.
• Compact, High‑Density Package  484‑FBGA (19×19 UBGA) enables compact PCB layouts while offering extensive I/O connectivity.
• Commercial‑Grade Reliability  Specified for 0 °C to 85 °C operation for mainstream embedded and consumer applications.
• Regulatory Compatibility  RoHS compliance supports modern manufacturing and environmental standards.
• Family Ecosystem  Access to Cyclone III family resources and pre‑verified IP (as provided by the Cyclone III device handbook) simplifies design reuse and reduces development time.

Why Choose EP3C80U484C8?

The EP3C80U484C8 positions itself as a practical choice for designers needing a balance of logic capacity, on‑chip memory, and extensive I/O in a low‑power Cyclone III FPGA family device. Its combination of 81,264 logic elements, approximately 2.81 Mbits of embedded memory, and 295 I/Os provides the building blocks for flexible hardware acceleration, protocol bridging, and system integration without excessive board area.

Ideal for teams developing commercial products where cost, power, and integration density are key, this device benefits from the Cyclone III family’s low‑power process and available device‑level features, enabling scalable designs and access to family‑level IP and development resources.

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