EP3C80U484I7
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 295 2810880 81264 484-FBGA |
|---|---|
| Quantity | 115 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-UBGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-FBGA | Number of I/O | 295 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 5079 | Number of Logic Elements/Cells | 81264 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2810880 |
Overview of EP3C80U484I7 – Cyclone® III Field Programmable Gate Array, 484-FBGA
The EP3C80U484I7 is an Intel Cyclone III FPGA in a 484-FBGA package designed for low-power, cost-sensitive applications requiring substantial logic and embedded memory. Built on the Cyclone III device family architecture, it provides a balance of integration, low power operation, and configurable I/O that suits embedded systems, communications interfaces, and portable or thermally constrained designs.
This device targets designs that need dense programmable logic (81,264 logic elements) and on-chip memory while operating across an industrial temperature range and a low core voltage domain.
Key Features
- Logic Capacity — 81,264 logic elements for implementing complex custom logic and state machines.
- Memory — Approximately 2.81 Mbits of embedded memory (total RAM bits: 2,810,880) to support buffering, FIFOs, and on-chip data storage.
- I/O Density — 295 I/O pins to support multiple external interfaces and parallel data paths.
- Clock Management — Family-level support for four phase-locked loops (PLLs) per device for clock synthesis and distribution (Cyclone III device family feature).
- Low-Power Operation — Cyclone III family design emphasis on low static power, suitable for power-sensitive and battery-powered applications.
- Embedded Processing Ecosystem — Supports the Cyclone III family ecosystem, including the Nios II embedded processor (family-level capability).
- Power and Temperature — Core supply range 1.15 V to 1.25 V and industrial operating temperature range from −40 °C to 100 °C.
- Package & Mounting — 484-FBGA (supplier package: 484-UBGA 19 × 19) for surface-mount assembly in compact PCBs.
- RoHS Compliant — Meets RoHS environmental requirements.
Typical Applications
- Battery-powered and portable equipment — Low static power characteristics and a low core-voltage range make the device suitable for designs where energy efficiency extends operating life.
- Embedded control and custom logic — Large logic element count and on-chip memory allow implementation of custom accelerators, protocol handling, and control logic.
- High I/O interface bridging — 295 I/O pins support interfacing between multiple peripherals, buses, or sensor arrays in medium-density systems.
- Thermally constrained and industrial systems — Rated for −40 °C to 100 °C operation to meet industrial temperature requirements.
- Clock-critical designs — Multiple PLLs and Cyclone III family clock-management features help implement robust timing architectures.
Unique Advantages
- Substantial programmable fabric: 81,264 logic elements provide headroom for complex state machines, datapaths, and interface logic without an external ASIC.
- On-chip memory for buffering: Approximately 2.81 Mbits of embedded RAM reduces reliance on external memory for many streaming and buffering tasks.
- Flexible I/O count: 295 I/O pins enable multiple parallel interfaces and dense connectivity on a single device.
- Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in industrial and harsh-environment installations.
- Compact board footprint: 484-FBGA 19 × 19 package allows high integration while saving PCB area and simplifying routing.
- Family ecosystem: Access to Cyclone III family features such as low-power design flow, PLL-based clock management, and Nios II support eases system-level development.
Why Choose EP3C80U484I7?
The EP3C80U484I7 positions itself as a practical choice for designers who need substantial programmable logic and embedded memory within a low-power, industrial-temperature FPGA. With 81,264 logic elements, approximately 2.81 Mbits of on-chip RAM, and 295 I/Os in a compact 484-FBGA package, it balances integration and I/O capability for embedded control, interface bridging, and power-sensitive applications.
Its Cyclone III family heritage delivers low-power operation and proven FPGA capabilities—helping teams reduce board-level complexity while leveraging family-level features like multiple PLLs and embedded processor support for scalable, maintainable designs.
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