EP3C80U484I7

IC FPGA 295 I/O 484UBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 295 2810880 81264 484-FBGA

Quantity 115 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-FBGANumber of I/O295Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5079Number of Logic Elements/Cells81264
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2810880

Overview of EP3C80U484I7 – Cyclone® III Field Programmable Gate Array, 484-FBGA

The EP3C80U484I7 is an Intel Cyclone III FPGA in a 484-FBGA package designed for low-power, cost-sensitive applications requiring substantial logic and embedded memory. Built on the Cyclone III device family architecture, it provides a balance of integration, low power operation, and configurable I/O that suits embedded systems, communications interfaces, and portable or thermally constrained designs.

This device targets designs that need dense programmable logic (81,264 logic elements) and on-chip memory while operating across an industrial temperature range and a low core voltage domain.

Key Features

  • Logic Capacity — 81,264 logic elements for implementing complex custom logic and state machines.
  • Memory — Approximately 2.81 Mbits of embedded memory (total RAM bits: 2,810,880) to support buffering, FIFOs, and on-chip data storage.
  • I/O Density — 295 I/O pins to support multiple external interfaces and parallel data paths.
  • Clock Management — Family-level support for four phase-locked loops (PLLs) per device for clock synthesis and distribution (Cyclone III device family feature).
  • Low-Power Operation — Cyclone III family design emphasis on low static power, suitable for power-sensitive and battery-powered applications.
  • Embedded Processing Ecosystem — Supports the Cyclone III family ecosystem, including the Nios II embedded processor (family-level capability).
  • Power and Temperature — Core supply range 1.15 V to 1.25 V and industrial operating temperature range from −40 °C to 100 °C.
  • Package & Mounting — 484-FBGA (supplier package: 484-UBGA 19 × 19) for surface-mount assembly in compact PCBs.
  • RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

  • Battery-powered and portable equipment — Low static power characteristics and a low core-voltage range make the device suitable for designs where energy efficiency extends operating life.
  • Embedded control and custom logic — Large logic element count and on-chip memory allow implementation of custom accelerators, protocol handling, and control logic.
  • High I/O interface bridging — 295 I/O pins support interfacing between multiple peripherals, buses, or sensor arrays in medium-density systems.
  • Thermally constrained and industrial systems — Rated for −40 °C to 100 °C operation to meet industrial temperature requirements.
  • Clock-critical designs — Multiple PLLs and Cyclone III family clock-management features help implement robust timing architectures.

Unique Advantages

  • Substantial programmable fabric: 81,264 logic elements provide headroom for complex state machines, datapaths, and interface logic without an external ASIC.
  • On-chip memory for buffering: Approximately 2.81 Mbits of embedded RAM reduces reliance on external memory for many streaming and buffering tasks.
  • Flexible I/O count: 295 I/O pins enable multiple parallel interfaces and dense connectivity on a single device.
  • Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in industrial and harsh-environment installations.
  • Compact board footprint: 484-FBGA 19 × 19 package allows high integration while saving PCB area and simplifying routing.
  • Family ecosystem: Access to Cyclone III family features such as low-power design flow, PLL-based clock management, and Nios II support eases system-level development.

Why Choose EP3C80U484I7?

The EP3C80U484I7 positions itself as a practical choice for designers who need substantial programmable logic and embedded memory within a low-power, industrial-temperature FPGA. With 81,264 logic elements, approximately 2.81 Mbits of on-chip RAM, and 295 I/Os in a compact 484-FBGA package, it balances integration and I/O capability for embedded control, interface bridging, and power-sensitive applications.

Its Cyclone III family heritage delivers low-power operation and proven FPGA capabilities—helping teams reduce board-level complexity while leveraging family-level features like multiple PLLs and embedded processor support for scalable, maintainable designs.

Request a quote or submit an inquiry to purchase the EP3C80U484I7 and receive pricing and availability information tailored to your project needs.

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