EP3CLS100F484C7

The EP3CLS100F484C7 is an Intel Cyclone® III family FPGA offering high logic density and integrated on-chip memory for commercial embedded systems. With 100,448 logic elements and approximately 4.45 Mbits of embedded memory, this surface-mount 484-BGA device targets high-volume, low-power, cost-sensitive applications where integration and I/O capacity matter.

Built on the Cyclone III device family architecture, the device provides the combination of low-power operation and system-level integration suitable for consumer, industrial-commercial, and communications designs that require substantial logic resources and a rich I/O count.

Key Features

• High Logic Capacity — 100,448 logic elements support complex combinational and sequential logic implementations for large-scale FPGA designs.
• Embedded Memory — Approximately 4.45 Mbits of on-chip RAM for buffering, packet processing, and local storage without external memory.
• Generous I/O — 278 user I/Os to support multiple high-density interfaces and board-level connectivity.
• Power and Voltage — Designed for core supply operation between 1.15 V and 1.25 V to match system power-rail requirements.
• Low-Power Family Characteristics — Based on Cyclone III family optimizations for low static power, suitable for thermally constrained and battery-aware designs.
• Clock Management — Family-level features include multiple PLLs for flexible clock synthesis and distribution (as described in Cyclone III family documentation).
• Package — 484-ball BGA (supplier package: 484-FBGA, 23×23) in a surface-mount form factor to simplify board routing and save board space.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial deployments.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

• Consumer Electronics — Implements complex control, user-interface, and signal-processing functions while minimizing BOM count through high integration.
• Communications Equipment — Provides on-chip memory and high I/O density for protocol processing, buffering, and interface bridging in networking modules.
• Embedded Systems — Hosts custom logic, soft processors and peripheral glue logic where moderate temperature range and commercial-grade qualification are acceptable.
• High-Volume, Low-Power Products — Suited for designs that prioritize power-aware operation and cost efficiency across large production runs.

Unique Advantages

• Large Logic Fabric: 100,448 logic elements enable implementation of extensive custom logic, reducing reliance on multiple discrete devices.
• Substantial Embedded Memory: Approximately 4.45 Mbits of on-chip RAM reduces external memory needs and streamlines board design.
• High I/O Count: 278 I/Os facilitate multiple parallel interfaces and complex PCB routing for connectivity-rich applications.
• Compact, Surface-Mount Package: 484-BGA (484-FBGA, 23×23) achieves high density in a compact footprint to save PCB area.
• Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation to match standard commercial deployment environments.
• RoHS Compliance: Supports lead-free manufacturing processes and environmental requirements.

Why Choose EP3CLS100F484C7?

The EP3CLS100F484C7 delivers a balanced combination of high logic capacity, on-chip memory, and extensive I/O in a compact BGA package, making it a practical choice for designers building cost-sensitive, low-power systems. Its Cyclone III family foundations provide proven low-power characteristics and system-level integration options that simplify board-level design and reduce component count.

This device is well suited to engineering teams that need substantial programmable logic and embedded memory within a commercial-temperature FPGA, backed by the Cyclone III device family documentation and design ecosystem.

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