EP3CLS100F484C8

IC FPGA 278 I/O 484FBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 278 4451328 100448 484-BGA

Quantity 1,371 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O278Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6278Number of Logic Elements/Cells100448
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4451328

Overview of EP3CLS100F484C8 – Cyclone® III FPGA, 484-BGA

The EP3CLS100F484C8 is an Intel Cyclone® III field programmable gate array in a 484-ball FBGA package, offering 100,448 logic elements, approximately 4.45 Mbits of embedded memory, and 278 user I/Os. It is a surface-mount, commercial-grade device with a supply voltage range of 1.15 V to 1.25 V and an operating temperature range of 0 °C to 85 °C.

Targeted at high-volume, low-power, cost-sensitive applications, this Cyclone III device family implementation combines high logic density and on-chip memory with extensive I/O and clock-management resources to support a wide range of system designs.

Key Features

  • Core Logic Density  100,448 logic elements provide capacity for complex custom logic integration and high-functionality designs.
  • Embedded Memory  Approximately 4.45 Mbits of on-chip RAM (4,451,328 bits) to store data and support local buffering without external memory.
  • I/O Capacity  278 user I/Os to accommodate multiple interfaces and peripherals in I/O-constrained designs.
  • I/O Standards and Signal Integrity  Device family supports a wide range of I/O standards and adjustable I/O slew rates to help manage signal integrity across interfaces.
  • Clock Management  Four PLLs per device with five outputs per PLL; PLLs are cascadable and dynamically reconfigurable for flexible clock synthesis and distribution.
  • Low-Power Architecture  Based on a low-power process and power-aware design flow to reduce static power consumption for thermally constrained or battery-powered applications.
  • Package and Mounting  484-FBGA (23×23) surface-mount package in a 484-BGA footprint for compact board integration.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C and supplied in a commercial grade.
  • Regulatory Compliance  RoHS-compliant.

Typical Applications

  • High-volume, cost-sensitive products  Leverages the Cyclone III family’s low-power and cost-focused attributes for consumer and volume production designs.
  • Portable and battery-powered systems  Low-power architecture suits thermally challenged or battery-operated devices that need extended operation.
  • I/O-intensive systems  High I/O count supports sensor aggregation, protocol bridging, and multi-channel interfaces where board-level I/O is constrained.
  • Embedded processing and custom peripherals  On-chip memory and logic density make the device suitable for integrating custom peripherals and soft-processor implementations.

Unique Advantages

  • High integration density: 100,448 logic elements enable consolidation of multiple functions into a single device, reducing PCB complexity.
  • Substantial on-chip memory: Approximately 4.45 Mbits of embedded RAM helps minimize external memory requirements and lowers BOM costs.
  • Extensive I/O resource: 278 I/Os provide design flexibility for diverse interface requirements without immediate need for I/O expanders.
  • Flexible clocking: Multiple PLLs with cascaded and reconfigurable outputs simplify clock-domain management and interface timing.
  • Low-power operation: Built on a low-power process and power-aware design flow to support energy-sensitive applications and reduce cooling needs.
  • Commercial, RoHS-compliant package: 484-FBGA (23×23) surface-mount package suited to standard assembly processes with environmental compliance.

Why Choose EP3CLS100F484C8?

The EP3CLS100F484C8 delivers a balanced combination of high logic density, substantial embedded memory, and a large I/O complement in a compact 484-FBGA footprint. Its low-power family heritage and flexible clocking resources make it suitable for design teams focused on integrating multiple functions while managing power and board-area constraints.

This commercial-grade Cyclone III FPGA is appropriate for customers building high-volume, cost-sensitive products that require on-chip memory, robust I/O, and configurable clock management. It provides a scalable platform within the Cyclone III device family for designs that prioritize integration and power efficiency.

Request a quote or submit an inquiry to receive pricing and availability for EP3CLS100F484C8 and support for your design requirements.

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