EP3CLS100F484C8
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 278 4451328 100448 484-BGA |
|---|---|
| Quantity | 1,371 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 278 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6278 | Number of Logic Elements/Cells | 100448 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4451328 |
Overview of EP3CLS100F484C8 – Cyclone® III FPGA, 484-BGA
The EP3CLS100F484C8 is an Intel Cyclone® III field programmable gate array in a 484-ball FBGA package, offering 100,448 logic elements, approximately 4.45 Mbits of embedded memory, and 278 user I/Os. It is a surface-mount, commercial-grade device with a supply voltage range of 1.15 V to 1.25 V and an operating temperature range of 0 °C to 85 °C.
Targeted at high-volume, low-power, cost-sensitive applications, this Cyclone III device family implementation combines high logic density and on-chip memory with extensive I/O and clock-management resources to support a wide range of system designs.
Key Features
- Core Logic Density 100,448 logic elements provide capacity for complex custom logic integration and high-functionality designs.
- Embedded Memory Approximately 4.45 Mbits of on-chip RAM (4,451,328 bits) to store data and support local buffering without external memory.
- I/O Capacity 278 user I/Os to accommodate multiple interfaces and peripherals in I/O-constrained designs.
- I/O Standards and Signal Integrity Device family supports a wide range of I/O standards and adjustable I/O slew rates to help manage signal integrity across interfaces.
- Clock Management Four PLLs per device with five outputs per PLL; PLLs are cascadable and dynamically reconfigurable for flexible clock synthesis and distribution.
- Low-Power Architecture Based on a low-power process and power-aware design flow to reduce static power consumption for thermally constrained or battery-powered applications.
- Package and Mounting 484-FBGA (23×23) surface-mount package in a 484-BGA footprint for compact board integration.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C and supplied in a commercial grade.
- Regulatory Compliance RoHS-compliant.
Typical Applications
- High-volume, cost-sensitive products Leverages the Cyclone III family’s low-power and cost-focused attributes for consumer and volume production designs.
- Portable and battery-powered systems Low-power architecture suits thermally challenged or battery-operated devices that need extended operation.
- I/O-intensive systems High I/O count supports sensor aggregation, protocol bridging, and multi-channel interfaces where board-level I/O is constrained.
- Embedded processing and custom peripherals On-chip memory and logic density make the device suitable for integrating custom peripherals and soft-processor implementations.
Unique Advantages
- High integration density: 100,448 logic elements enable consolidation of multiple functions into a single device, reducing PCB complexity.
- Substantial on-chip memory: Approximately 4.45 Mbits of embedded RAM helps minimize external memory requirements and lowers BOM costs.
- Extensive I/O resource: 278 I/Os provide design flexibility for diverse interface requirements without immediate need for I/O expanders.
- Flexible clocking: Multiple PLLs with cascaded and reconfigurable outputs simplify clock-domain management and interface timing.
- Low-power operation: Built on a low-power process and power-aware design flow to support energy-sensitive applications and reduce cooling needs.
- Commercial, RoHS-compliant package: 484-FBGA (23×23) surface-mount package suited to standard assembly processes with environmental compliance.
Why Choose EP3CLS100F484C8?
The EP3CLS100F484C8 delivers a balanced combination of high logic density, substantial embedded memory, and a large I/O complement in a compact 484-FBGA footprint. Its low-power family heritage and flexible clocking resources make it suitable for design teams focused on integrating multiple functions while managing power and board-area constraints.
This commercial-grade Cyclone III FPGA is appropriate for customers building high-volume, cost-sensitive products that require on-chip memory, robust I/O, and configurable clock management. It provides a scalable platform within the Cyclone III device family for designs that prioritize integration and power efficiency.
Request a quote or submit an inquiry to receive pricing and availability for EP3CLS100F484C8 and support for your design requirements.

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