EP3CLS100F484I7N

The EP3CLS100F484I7N is an industrial‑grade Cyclone® III field programmable gate array (FPGA) in a 484‑BGA (484‑FBGA, 23×23) package. It delivers substantial logic capacity and on‑chip memory while operating from a 1.15 V to 1.25 V core supply and across an industrial temperature range of −40 °C to 100 °C.

Built on the Cyclone III device family architecture, this device targets high‑volume, low‑power, cost‑sensitive applications that require a balance of logic density, I/O count, and embedded memory for system integration and flexible interface implementations.

Key Features

• Logic Capacity — 100,448 logic elements to implement complex programmable logic and custom digital functions.
• Embedded Memory — Approximately 4.45 Mbits of on‑chip RAM to support buffering, lookup tables, and local data storage.
• I/O and Interfaces — 278 user I/Os for broad interfacing to peripherals, sensors, and external logic.
• Low‑Voltage Core — Core voltage supply range of 1.15 V to 1.25 V to match modern low‑voltage system rails.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation for reliable performance in industrial environments.
• Package and Mounting — 484‑BGA (484‑FBGA, 23×23) surface‑mount package for high pin density and compact board integration.
• Family Advantages — Based on the Cyclone III family with low‑power TSMC process technology and device features designed for low power consumption and system integration.
• Compliance — RoHS‑compliant component.

Typical Applications

• High‑volume, low‑power systems — Suitable for designs where power efficiency and cost sensitivity are primary concerns.
• Portable and handheld devices — Cyclone III family attributes support extended battery life and operation in thermally challenging environments.
• User I/O constrained systems — High I/O count and on‑chip memory enable compact designs that require extensive interfacing.
• Embedded processing and integration — Large logic capacity and embedded memory provide headroom for customer IP and system control logic.

Unique Advantages

• High logic density: 100,448 logic elements provide substantial programmable fabric for complex logic and control functions.
• Significant on‑chip memory: Approximately 4.45 Mbits of embedded RAM reduces dependence on external memory for many applications.
• Robust industrial operation: −40 °C to 100 °C rating supports deployment in industrial and thermally variable environments.
• Flexible I/O capacity: 278 I/Os accommodate a wide variety of peripheral and interface requirements without immediate need for external translators.
• Compact, high‑pin package: 484‑BGA (23×23) enables dense board integration while providing numerous signal connections.
• Low‑voltage core operation: 1.15 V to 1.25 V supply range aligns with modern low‑voltage system designs.

Why Choose EP3CLS100F484I7N?

The EP3CLS100F484I7N positions itself where substantial logic resources, embedded memory, and a high I/O count are required within an industrial temperature envelope. Its Cyclone III family heritage delivers a low‑power architecture and device characteristics suited to cost‑sensitive, high‑volume applications that still demand integration and flexibility.

This device is appropriate for engineering teams building systems that need on‑chip capacity for custom logic and local data storage, a compact high‑pin package for dense board layouts, and an industrial temperature rating for reliable field operation. The Cyclone III family ecosystem provides software and IP resources to accelerate design implementation.

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