EP3CLS100F780C8

The EP3CLS100F780C8 is a Cyclone® III field-programmable gate array (FPGA) offering a high-functionality, low-power architecture optimized for cost-sensitive, high-volume applications. Built on the Cyclone III device family, the part combines a large logic element count with substantial on-chip memory and a high I/O count for flexible system integration.

Designed for surface-mount assembly in a 780-BGA package, this commercial-grade device targets embedded systems, communications equipment, and other applications that benefit from dense logic, on-chip RAM, and configurable I/O while operating within standard commercial temperature and voltage ranges.

Key Features

• Logic Capacity  100,448 logic elements provide significant gate density for complex programmable logic functions and custom accelerators.
• On-chip Memory  Approximately 4.45 Mbits of embedded memory to support buffering, FIFOs, and local data storage without external RAM.
• I/O and Interfaces  413 user I/O pins for wide external connectivity and interface flexibility in mixed-signal systems and multi-protocol designs.
• Clocking  Cyclone III device family includes integrated PLL resources for robust clock management and synthesis across system and I/O domains.
• Low-Power Architecture  Leveraging TSMC low-power process technology and power-aware device design, Cyclone III devices deliver low static power consumption at the device-family level.
• Voltage and Mounting  Operates from 1.15 V to 1.25 V and is supplied in a surface-mount 780-FBGA (29×29) package for compact PCB designs.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation, suitable for standard commercial-environment applications.
• Standards and I/O Support (Family)  Cyclone III family supports a broad range of I/O standards and features such as adjustable slew rates and on-chip termination calibration to improve signal integrity across PVT conditions.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Portable and Handheld Systems  Low-power device-family characteristics help extend battery life in portable electronics that require significant programmable logic and memory.
• Communications and Networking  High I/O count and integrated clocking resources make the device well suited for protocol bridging, packet processing, and interface aggregation.
• Embedded Control and Processing  Large logic capacity and embedded RAM enable custom control logic, hardware accelerators, and local data buffering for embedded systems.
• Consumer and Industrial Electronics (Commercial Grade)  Flexible I/O and compact BGA packaging support user interfaces, sensor aggregation, and mid-range density logic in commercial products.

Unique Advantages

• High Logic and Memory Integration: Combines 100,448 logic elements with approximately 4.45 Mbits of embedded memory to reduce dependence on external components and simplify BOM.
• Broad I/O Capacity: 413 I/Os provide the connectivity necessary for multi-channel interfaces and complex board-level integration without sacrificing routing headroom.
• Power-Aware Design: Built on a low-power process with device-family optimizations to minimize static power, helping control system thermal and energy budgets.
• Compact, Production-Ready Package: 780-FBGA (29×29) package supports high-density PCB designs while maintaining surface-mount manufacturability.
• Commercial Temperature Operation: Rated for 0 °C to 85 °C to meet standard commercial application requirements.
• Family-Level Ecosystem: Part of the Cyclone III device family, which includes clocking, I/O standard support, and design-flow features to accelerate development and deployment.

Why Choose EP3CLS100F780C8?

EP3CLS100F780C8 delivers a balance of high logic density, substantial embedded memory, and extensive I/O in a compact 780-BGA package, making it a practical choice for commercial applications that require programmable logic with low-power characteristics. Its operating voltage range and commercial temperature rating support mainstream embedded designs while the Cyclone III family features help streamline clocking, I/O, and power-aware design choices.

This device is well suited to engineering teams developing cost-sensitive, high-volume products that need on-chip resources to reduce external components, accelerate time-to-market, and maintain flexibility across a range of system architectures.

Request a quote or submit an inquiry for EP3CLS100F780C8 to get pricing and availability information for your project requirements.