EP3C80U484C7

The EP3C80U484C7 is an Intel Cyclone® III field programmable gate array (FPGA) in a 484‑FBGA package designed for commercial, cost‑sensitive designs that require substantial logic and I/O integration. It delivers 81,264 logic elements, approximately 2.81 Mbits of embedded memory, and up to 295 user I/Os in a compact surface‑mount UBGA footprint.

Built on the Cyclone III family architecture, the device targets applications where low power, high I/O count and system integration reduce bill of materials and simplify board-level design. The device operates from a core supply of 1.15 V to 1.25 V and is specified for commercial temperature operation (0 °C to 85 °C).

Key Features

• Core / Logic Capacity  81,264 logic elements for mid-range FPGA designs requiring substantial combinational and sequential logic resources.
• Embedded Memory  Approximately 2.81 Mbits of on-chip RAM to support buffering, lookup tables, and embedded data paths without external memory.
• I/O Density & Standards  Up to 295 user I/Os; Cyclone III family supports a broad set of I/O standards to enable diverse interface requirements.
• Clock Management  Family architecture includes multiple phase-locked loops (PLLs) for flexible clock synthesis and distribution.
• Power & Supply  Operates with a core supply from 1.15 V to 1.25 V and benefits from Cyclone III low‑power design techniques to support power‑sensitive applications.
• Package & Mounting  484‑FBGA (supplier device package: 484‑UBGA, 19×19) in a surface mount format suited to space‑constrained boards.
• Commercial Grade Operation  Rated for 0 °C to 85 °C operating temperature for mainstream commercial applications.
• System Integration  High memory‑to‑logic and multiplier‑to‑logic ratios inherent to the Cyclone III family help reduce external components and simplify system design.

Typical Applications

• Portable and Handheld Devices  Low‑power family characteristics and compact package make the device suitable for battery‑sensitive, space‑constrained designs where extended battery life is desirable.
• Consumer and High‑Volume Electronics  Mid‑range logic capacity and on‑chip memory support feature‑rich consumer products that require cost‑effective, high‑volume deployment.
• Embedded Control and Interface Bridging  High I/O count and flexible clocking enable sensor interfacing, protocol bridging, and system control tasks.
• Communications and I/O‑Dense Systems  Large number of user I/Os and on‑chip resources help consolidate functions in communication endpoints and peripheral controllers.

Unique Advantages

• Substantial Logic in a Compact Footprint: 81,264 logic elements delivered in a 484‑FBGA package provide strong integration for mid‑range designs while keeping PCB area low.
• On‑Chip Memory to Reduce BOM: Approximately 2.81 Mbits of embedded RAM reduces dependence on external memory devices and simplifies board design.
• High I/O Count for Flexible Interfaces: Up to 295 user I/Os accommodate multiple peripherals, buses, and interface bridges without needing additional I/O expanders.
• Power‑Aware Operation: Core voltage range of 1.15 V to 1.25 V and Cyclone III low‑power design techniques help meet power budgets in portable and thermally constrained systems.
• Robust Clocking Resources: Multiple PLLs allow flexible clock generation and distribution for complex multi‑clock systems, reducing external clocking components.
• Commercial Temperature Range: Specified 0 °C to 85 °C operation aligns with mainstream commercial product deployment requirements.

Why Choose EP3C80U484C7?

The EP3C80U484C7 brings a balanced mix of logic capacity, embedded memory and I/O density in a compact 484‑FBGA package, making it a practical choice for commercial applications that need mid‑range FPGA resources with power‑sensitive operation. Its Cyclone III family architecture emphasizes low power and system integration, helping designers reduce component count and meet tight power and area budgets.

This device is well suited for product teams designing high‑volume consumer electronics, portable devices, embedded controllers and I/O‑intensive systems that require reliable logic, on‑chip memory and flexible interfacing in a commercial temperature footprint.

Request a quote or submit a parts inquiry to get pricing and availability for EP3C80U484C7 and accelerate your design evaluation.