EP3C80U484C6N

The EP3C80U484C6N is an Intel Cyclone® III family field programmable gate array (FPGA) in a 484-FBGA package designed for cost- and power-sensitive applications. Based on the Cyclone III device family, it combines high logic density and embedded memory with low-power silicon and a compact surface-mount package suitable for high-volume designs.

Typical use cases include portable and handheld products, thermally constrained systems, and other high-volume, low-power designs where dense logic, significant I/O, and on-chip memory are required.

Key Features

• Logic Capacity – 81,264 logic elements provide substantial programmable logic resources for complex control, signal processing, and glue-logic functions.
• Embedded Memory – Approximately 2.81 Mbits of on-chip RAM to support buffering, lookup tables, and embedded data storage without external memory.
• I/O Density – 295 user I/O pins enable broad interfacing to peripherals, sensors, and high-pin-count system designs.
• Clock Management – Family-level support for up to four PLLs per device with five outputs each, allowing flexible clock synthesis and distribution in-system.
• Power and Voltage – Designed for low-power operation; device supply range specified at 1.15 V to 1.25 V to match system power rails and low-voltage designs.
• Package and Mounting – 484-FBGA (supplier package: 484-UBGA, 19×19) surface-mount package for compact PCB integration.
• Operating Range – Commercial temperature grade with operating range from 0 °C to 85 °C for typical commercial applications.
• Compliance – RoHS-compliant to support environmental and manufacturing requirements.
• I/O Standards and Signal Integrity – Cyclone III family support for a wide range of I/O standards (LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X, LVPECL, BLVDS, LVDS, mini-LVDS, RSDS, PPDS) and adjustable slew rates to aid signal integrity.

Typical Applications

• Portable and Handheld Devices – Low-power design and compact FBGA package enable integration into battery-powered and space-constrained products.
• Consumer Electronics – High logic density and substantial I/O count support display controllers, user interfaces, and peripheral bridging in consumer systems.
• Communications and Networking – On-chip RAM and programmable logic facilitate packet handling, protocol bridging, and custom I/O adaptation.
• Industrial Controls – Programmable logic capacity and flexible I/O allow implementation of motor control interfaces, sensor aggregation, and machine control functions within commercial-temperature environments.

Unique Advantages

• High Logic Density: 81,264 logic elements enable consolidation of multiple functions into a single device, reducing board complexity.
• Significant On-Chip Memory: Approximately 2.81 Mbits of embedded RAM reduces dependence on external memory, lowering BOM and simplifying routing.
• Large I/O Count: 295 I/O pins provide flexibility to connect numerous peripherals and interfaces without external expanders.
• Low-Voltage Operation: 1.15–1.25 V supply range supports modern low-voltage system architectures and helps reduce power consumption.
• Compact, Surface-Mount Package: 484-FBGA (19×19 UBGA) offers a small PCB footprint for dense system designs.
• Standards-Rich I/O Support: Support for numerous I/O standards and adjustable slew rates aids integration with diverse system interfaces while helping maintain signal integrity.

Why Choose EP3C80U484C6N?

The EP3C80U484C6N positions itself as a commercially graded Cyclone III FPGA option for engineers needing a balance of high logic capacity, meaningful embedded memory, and a large I/O complement in a compact surface-mount package. Its low-voltage operation and family-level low-power characteristics align well with cost-sensitive and thermally constrained designs.

This device is suited to teams designing high-volume consumer, portable, communication, or industrial-control products that require on-chip integration to reduce BOM, simplify board routing, and shorten time to market while relying on a well-documented FPGA family architecture.

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