EP3C80F780I7N

The EP3C80F780I7N is an industrial-grade Cyclone III FPGA offering a high-count I/O, substantial embedded memory, and a large logic fabric in a 780-ball FBGA package. As a member of the Cyclone III device family, it delivers low-power operation and architecture features designed for cost- and power-sensitive applications.

Targeted at designs that require a balance of logic density, on-chip memory and flexible I/O, this device is suited for high-volume embedded systems, communications interfaces, and industrial control applications that demand robust temperature and voltage operating ranges.

Key Features

• Logic Capacity  Provides 81,264 logic elements to implement complex custom logic and state machines.
• Embedded Memory  Approximately 2.81 Mbits of on-chip RAM for buffering, packet storage, or table-based processing.
• I/O Density  429 user I/O pins to support multiple parallel interfaces, high-pin-count sensors, or multi-channel connectivity.
• Power Supply  Core voltage supply range of 1.15 V to 1.25 V for standard Cyclone III core operation.
• Package & Mounting  780-FBGA package (29×29) in a surface-mount form factor for high-density PCB integration.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial and thermally demanding environments.
• Regulatory Compliance  RoHS compliant, supporting modern environmental and assembly requirements.
• Cyclone III Family Benefits  Inherits family-level attributes such as low-power process technology, high memory-to-logic ratio, multi-standard I/O support and integrated clock management features.

Typical Applications

• Industrial Control  High logic capacity and industrial temperature range make this device appropriate for PLCs, motion controllers and process instrumentation requiring reliable operation in harsh environments.
• Communication Interfaces  Large I/O count and on-chip memory support protocol bridging, packet buffering and custom interface logic in networking and telecom equipment.
• Embedded Systems  Combines logic density and embedded RAM for custom accelerators, system glue logic, and control functions in compact embedded platforms.
• High-Density I/O Applications  Suitable for applications requiring many parallel signals such as video front-ends, sensor arrays, or multi-channel data acquisition systems.

Unique Advantages

• High Logic Density: 81,264 logic elements give headroom for complex finite state machines, data-paths and custom processing while reducing the need for multiple devices.
• Generous On-Chip Memory: Approximately 2.81 Mbits of RAM enables local buffering and table storage, simplifying board-level memory requirements.
• Extensive I/O Resources: 429 I/Os allow flexible partitioning between control, data and host interfaces without external multiplexing.
• Industrial Robustness: Temperature rating from −40 °C to 100 °C and surface-mount 780-FBGA packaging support deployment in demanding industrial environments.
• Low-Power Family Architecture: Benefits from Cyclone III low-power design optimizations to help meet tight power budgets in portable and thermally constrained systems.
• RoHS Compliant: Meets environmental assembly requirements for modern manufacturing and global distribution.

Why Choose EP3C80F780I7N?

The EP3C80F780I7N positions itself as a practical choice for engineers who need a balance of logic capacity, memory and I/O in an industrial-temperature FPGA. Its Cyclone III family heritage brings power-aware silicon and a rich architecture that simplifies integration of clock management and interface logic.

This device suits teams building cost- and power-sensitive products that still require substantial on-chip resources and reliable operation over a wide temperature range. Its form factor and compliance characteristics help streamline integration into production designs and long-term deployments.

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