EP3C80F780C7N

The EP3C80F780C7N is an Intel Cyclone® III field programmable gate array (FPGA) offered in a 780‑ball fine‑pitch BGA package. It provides 81,264 logic elements, approximately 2.8 Mbits of embedded memory, and up to 429 general‑purpose I/O pins for mid‑range, I/O‑rich designs.

Designed for the Cyclone III device family, this device targets cost‑sensitive, low‑power, and high‑functionality applications where integration density, power efficiency, and flexible I/O are key design drivers.

Key Features

• Logic capacity  81,264 logic elements and 5,079 logic array blocks (LABs) provide substantial programmable logic for mid‑range designs.
• Embedded memory  Approximately 2.8 Mbits of on‑chip RAM to support buffering, packet storage, and local data processing without external memory.
• I/O count and flexibility  Up to 429 I/O pins support complex interfaces and high pin‑count system connectivity for diverse peripherals and buses.
• Clock management  Cyclone III family architecture includes integrated PLL resources for flexible clock synthesis and management within systems.
• Low‑power family architecture  Built on a low‑power process and device‑level optimizations that help reduce static power consumption in battery‑sensitive or thermally constrained applications.
• Power and operating conditions  Core supply range 1.15 V to 1.25 V and commercial operating temperature 0 °C to 85 °C for standard electronics environments.
• Package and mounting  780‑FBGA (29 × 29) ball‑grid array, surface‑mount package for compact board integration and automated assembly.
• Regulatory status  RoHS compliant, supporting environmentally responsible product builds.

Typical Applications

• Embedded control and interface hubs  Use the device’s logic density and high I/O count to consolidate control, protocol bridging, and signal multiplexing in mid‑range embedded systems.
• Communications and networking  On‑chip memory and abundant I/O make it suitable for packet buffering, PHY interface glue logic, and protocol adaptation in networking equipment.
• Consumer and handheld electronics  Low‑power family architecture enables longer battery life and reduced thermal management for portable or hand‑held devices.
• Industrial automation  Leverage flexible I/O and programmable logic to implement sensor aggregation, motor control interfaces, and custom timing logic for automation subsystems.

Unique Advantages

• Substantial programmable logic: The 81,264 logic elements provide the headroom to implement complex state machines, datapaths, and custom accelerators without external ASICs.
• Integrated memory resources: Approximately 2.8 Mbits of embedded RAM reduce dependence on external memory and simplify PCB routing and bill of materials.
• High I/O density: 429 I/Os enable direct connections to multiple peripherals and high‑pin‑count interfaces, reducing the need for external multiplexers or bridges.
• Compact system footprint: The 780‑FBGA (29×29) surface‑mount package supports dense board layouts and automated assembly workflows.
• Energy‑aware architecture: Family‑level low‑power design choices help meet thermal and power budgets in portable and thermally constrained applications.
• Environmentally compliant: RoHS compliance supports designs aimed at global markets with environmental regulatory requirements.

Why Choose EP3C80F780C7N?

The EP3C80F780C7N combines mid‑range logic density with significant on‑chip RAM and a high I/O count in a compact 780‑BGA package, making it a practical choice for designers who need integration, flexible interfacing, and power‑aware operation. As a member of the Cyclone III family, it benefits from device‑level low‑power optimizations and a suite of system integration features that simplify clock management and on‑chip processing.

This device is well suited for engineering teams building cost‑sensitive, high‑functionality systems—providing a balance of capacity, I/O flexibility, and environmental compliance that supports scalable, long‑life product designs.

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