EP3C80F780C7

The EP3C80F780C7 is a Cyclone® III field programmable gate array (FPGA) device optimized for high-functionality, low-power, cost-sensitive designs. It is built on the Cyclone III device family architecture, which leverages TSMC low-power process technology and silicon optimizations to reduce power consumption while delivering substantial logic and I/O capacity.

With 81,264 logic elements, approximately 2.81 Mbits of embedded memory, and 429 user I/Os in a 780‑FBGA (29×29) package, this commercial-grade FPGA targets high-volume applications that require dense logic, high I/O count, and efficient power management.

Key Features

• Logic Capacity — 81,264 logic elements provide substantial programmable logic resources for complex custom logic and glue-logic implementations.
• On-chip Memory — Approximately 2.81 Mbits of embedded memory for buffers, FIFOs, and state storage integrated on die to simplify system design.
• I/O Density — 429 user I/Os enable connectivity for multiple interfaces and peripheral buses without extensive external circuitry.
• Power and Voltage — Device operates with a core supply range of 1.15 V to 1.25 V and benefits from the Cyclone III low-power process for reduced static power consumption.
• Clocking and Timing — Cyclone III family features include multiple phase-locked loops (PLLs) for flexible clock management and synthesis (family-level feature).
• Package — 780‑FBGA (29×29) ball-grid array package for compact board integration and reliable surface-mount assembly.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation, suitable for commercial equipment designs.
• Design Ecosystem — Part of the Cyclone III family, which supports a collection of family-level IP such as embedded processor options and a broad set of I/O standards.
• Regulatory Status — RoHS compliant.

Typical Applications

• Portable and Handheld Devices — Low-power Cyclone III technology and reduced static power make this FPGA suitable for battery-powered and thermally-constrained products.
• High‑volume Consumer Electronics — Cost-sensitive designs that require a balance of functionality and low per-unit cost can leverage the device’s logic and memory capacity.
• I/O‑Rich Interface Bridging — With 429 user I/Os, the FPGA is well-suited for bridging multiple peripheral buses, custom protocol adaptation, and I/O aggregation.
• Embedded Control and Custom Logic — Large logic capacity and on-chip memory support embedded control functions, protocol handling, and custom accelerators.

Unique Advantages

• High Integration: 81,264 logic elements and approximately 2.81 Mbits of embedded memory reduce external component count and simplify board-level design.
• High I/O Count: 429 user I/Os provide flexibility to connect sensors, transceivers, and parallel interfaces without complex external multiplexing.
• Low-Power Foundation: Built on TSMC low-power process technology and Cyclone III family optimizations to support designs with strict power budgets.
• Compact Package: 780‑FBGA (29×29) delivers high-pin-count capability in a compact surface-mount form factor for space-constrained PCBs.
• Commercial Performance Range: Rated for 0 °C to 85 °C operation and commercial-grade applications where that temperature range is appropriate.
• Ecosystem-Level Support: Part of the Cyclone III family with family-level IP resources and clock management features to accelerate development.

Why Choose EP3C80F780C7?

The EP3C80F780C7 combines substantial programmable logic, embedded memory, and high I/O density in a low-power Cyclone III architecture, making it a practical choice for commercial, high-volume designs that need a cost-effective, integrated FPGA solution. Its package, voltage range, and family-level features support compact, efficient system designs that require significant on-chip resources without excessive power consumption.

This device is suited for engineers developing portable electronics, consumer products, and I/O-intensive applications who need proven Cyclone III family capabilities—dense logic, embedded memory, and versatile I/O—backed by documented device specifications and RoHS compliance.

If you would like pricing, lead-time, or to request a quote for EP3C80F780C7, please submit an inquiry or request a quote and include your desired quantity and required delivery timeframe.