EP3C80F780C6N

The EP3C80F780C6N is a Cyclone III Field Programmable Gate Array (FPGA) in a 780-ball FBGA package (29 × 29). It provides a mid-range, low-power programmable fabric suitable for commercial designs that require high I/O density, substantial logic capacity, and embedded RAM.

Built on the Cyclone III device family architecture, this device targets cost- and power-sensitive applications where integration, flexible I/O, and on-chip memory are important design drivers.

Key Features

• Logic Capacity  Approximately 81,264 logic elements for implementing complex combinational and sequential logic.
• Embedded Memory  Approximately 2.81 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
• I/O Density  429 user I/Os to simplify external interfacing and minimize the need for additional I/O expanders.
• Package & Mounting  780-ball FBGA (29 × 29) package, surface-mount mounting for compact PCB designs.
• Power Supply  Core voltage range of 1.15 V to 1.25 V, consistent with low-voltage FPGA operation.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Family-Level Low-Power Benefits  Cyclone III family devices leverage a low-power process and power-aware design flow; the family description indicates devices in this range can achieve static power consumption below ¼ watt.
• Clocking & System Integration (Family)  Cyclone III family devices include multiple PLLs and clock-management features to support robust clock synthesis and interface timing (family-level capability).
• RoHS Compliance  RoHS-compliant device for regulatory and environmental considerations.

Typical Applications

• Consumer & Portable Electronics  Low-power operation and on-chip memory make the device suitable for battery-aware consumer devices and handheld systems that require programmable logic and signal handling.
• Communications & Networking  High I/O count and abundant logic elements enable implementation of protocol bridging, interface aggregation, and custom packet-handling logic.
• Video & Imaging  Large logic capacity and embedded RAM support image processing pipelines, buffering, and timing-critical video interfaces.
• Embedded Processing & Prototyping  Ample logic and memory resources allow for implementing soft processors, custom peripherals, and hardware acceleration blocks for rapid development and validation.

Unique Advantages

• High Logic Density:  Approximately 81,264 logic elements permit complex designs and multiple concurrent functions on a single device, reducing BOM and board complexity.
• Significant On-Chip Memory:  About 2.81 Mbits of embedded RAM enables local buffering and state storage without external memory, improving performance and reducing external component count.
• Extensive I/O Resources:  429 user I/Os allow flexible interfacing to peripherals, high-pin-count connectors, and multiple simultaneous I/O standards (family-level support described in the Cyclone III handbook).
• Compact, Surface-Mount Package:  780-FBGA (29 × 29) delivers a dense footprint for space-constrained PCBs while supporting the I/O and power requirements of the device.
• Commercial Temperature Range:  Rated for 0 °C to 85 °C, suitable for a wide range of commercial electronics deployments.
• Regulatory & Environmental Compliance:  RoHS-compliant to support modern supply-chain and manufacturing requirements.

Why Choose EP3C80F780C6N?

The EP3C80F780C6N offers a balanced combination of logic capacity, embedded memory, and high I/O density in a compact 780-ball BGA package, making it well suited for commercial-grade designs that demand integration without sacrificing flexibility. Its placement within the Cyclone III family aligns it with low-power silicon process benefits and family-level system features that support reliable clocking and interface options.

This device is a fit for development teams and product designers seeking a programmable, mid-range FPGA to consolidate functions, reduce external components, and accelerate time-to-market while maintaining commercial operating requirements and environmental compliance.

If you need pricing, lead-time, or availability information, submit a quote request or RFQ and our team will respond with detailed pricing and availability information.