EP3C80F484C8N

The EP3C80F484C8N is an Intel Cyclone® III FPGA in a 484-ball fine-pitch BGA (23 × 23) package designed for commercial applications that require high integration with low power operation. This device provides 81,264 logic elements, approximately 2.81 Mbits of embedded memory, and 295 user I/Os, making it suitable for mid-range programmable logic implementations.

Built on the Cyclone III device family architecture, the device targets cost- and power-sensitive designs that benefit from on-chip memory, extensive I/O, and support from the Cyclone III ecosystem and development tools.

Key Features

• Logic Capacity — 81,264 logic elements to implement complex custom logic and control functions.
• Embedded Memory — Total on-chip RAM of 2,810,880 bits (approximately 2.81 Mbits) for FIFOs, buffers, and local data storage.
• I/O Resources — 295 user I/Os to support multiple interfaces and board-level connectivity requirements.
• Power and Supply — Designed for operation with core supply from 1.15 V to 1.25 V, aligning with low-power system designs.
• Package and Mounting — 484-ball FBGA (23 × 23) surface-mount package for high-density board integration.
• Operating Range — Commercial-grade temperature range from 0 °C to 85 °C for standard commercial deployments.
• Family-Level Low-Power Design — Cyclone III family characteristics include TSMC low-power process technology and power-aware design flow to help minimize static power consumption.
• Development Ecosystem — Supported by the Cyclone III device family handbook and associated design flows, including pre-built IP cores referenced for the family.
• Regulatory — RoHS compliant for restricted-substance conformance.

Typical Applications

• Portable and Battery-Powered Equipment — Low-power characteristics and compact package make it suitable for designs where power efficiency extends operating life.
• Embedded Control and Processing — On-chip memory and logic density support custom control logic, state machines, and embedded processing tasks.
• High-Density I/O Systems — With 295 user I/Os, the device is useful for bridging, interface aggregation, and high-connectivity board roles.
• Commercial Electronics — Commercial temperature rating and surface-mount 484-FBGA package align with consumer and general-purpose commercial applications.

Unique Advantages

• Substantial Logic Resource — 81,264 logic elements provide the headroom needed to implement complex logic and multiple functions on a single device.
• Integrated Memory — Approximately 2.81 Mbits of embedded RAM reduces external memory dependency for buffering and on-chip data processing.
• High I/O Count — 295 I/Os simplify board routing for multi-interface designs and reduce the need for external multiplexing.
• Compact, High-Density Package — 484-FBGA (23 × 23) offers a compact footprint for space-constrained PCBs while maintaining high pin count.
• Commercial-Grade Availability — Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream commercial product requirements.
• Vendor Ecosystem — Backed by the Cyclone III device family documentation and available IP resources to accelerate design integration.

Why Choose EP3C80F484C8N?

The EP3C80F484C8N combines substantial logic capacity, meaningful on-chip RAM, and a high I/O count in a compact 484-FBGA package, addressing mid-range programmable logic needs where integration and power efficiency matter. Its specification for 1.15 V–1.25 V core supply and the Cyclone III family’s low-power process positioning make it a practical choice for commercial systems that need programmable flexibility without excessive power or board area.

This device is suited for engineers developing embedded control, interface-rich, or portable products who want access to the Cyclone III family’s development resources and pre-built IP to shorten development time and reduce system BOM complexity.

If you need pricing, availability, or a formal quote for EP3C80F484C8N, submit a request and our team will respond with the necessary procurement details.