EP3C80F484C7N

The EP3C80F484C7N is an Intel Cyclone III family FPGA offering a balance of logic capacity, embedded memory, and I/O density in a low-power, cost-sensitive platform. It implements the Cyclone III architecture intended for applications that require substantial programmable logic (81,264 logic elements) alongside approximately 2.81 Mbits of on-chip RAM and up to 295 user I/Os.

Designed for surface-mount deployment in a 484-ball FBGA (23×23) package, this commercial-grade device supports a 1.15 V to 1.25 V core supply and an operating temperature range of 0 °C to 85 °C, making it suitable for high-volume, low-power system designs.

Key Features

• Logic Capacity — 81,264 logic elements provide substantial programmable fabric for mid-range FPGA designs.
• Configurable Logic Blocks — 5,079 configurable logic blocks for partitioned logic implementation and resource mapping.
• Embedded Memory — Approximately 2.81 Mbits of on-chip RAM to support buffering, FIFOs, and embedded data structures.
• I/O Density — 295 user I/Os to support complex interfacing and multiple parallel connections.
• Power — Core voltage supply range of 1.15 V to 1.25 V consistent with Cyclone III low-power operation characteristics.
• Package & Mounting — 484-FBGA (23×23) package, surface-mount mounting type for compact PCB integration.
• Commercial Grade Temperature — Rated for 0 °C to 85 °C operation for standard commercial applications.
• Environmental Compliance — RoHS compliant.
• Family-Level Capabilities — As a Cyclone III device, it benefits from the family’s low-power design focus and support for high memory-to-logic ratios and robust clock management features (PLLs) as described in the Cyclone III device handbook.

Typical Applications

• Portable and Handheld Devices — Low-power architecture and on-chip memory help extend battery life for portable applications where power budget is critical.
• High-Volume Consumer Electronics — Cost-sensitive Cyclone III family characteristics suit mass-produced products that require programmable logic and moderate I/O.
• Embedded Systems with Rich I/O — With 295 user I/Os and flexible package options, it supports designs that need multiple sensor, control, or data interfaces.
• Embedded Processing — Cyclone III family support for embedded processors (Nios II) enables custom, low-cost embedded solutions with on-chip logic and memory.

Unique Advantages

• Substantial Logic and Memory in a Compact Package: 81,264 logic elements and ~2.81 Mbits of embedded RAM in a 484-FBGA (23×23) package reduce board-level complexity and BOM count.
• High I/O Count: 295 user I/Os allow dense peripheral and bus connections without external I/O expanders.
• Designed for Low-Power Systems: Part of the Cyclone III family engineered for low power, offering advantages for thermally constrained and battery-powered designs.
• Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation for mainstream commercial deployments.
• RoHS Compliant: Conforms to RoHS requirements to simplify environmental compliance in product development.
• Flexible Integration: Surface-mount 484-FBGA package supports compact PCB layouts for space-constrained designs.

Why Choose EP3C80F484C7N?

The EP3C80F484C7N delivers a balanced, mid-range FPGA option for designers seeking a combination of sizable programmable logic, embedded memory, and high I/O count within a low-power Cyclone III platform. Its commercial-grade temperature range, RoHS compliance, and compact 484-FBGA package make it well suited for cost-sensitive, high-volume applications where integration and power efficiency matter.

Choose this device when your design requires significant on-chip resources (logic and RAM), broad interfacing capability, and the Cyclone III family’s low-power characteristics—enabling scalable designs backed by Intel’s Cyclone III device architecture and supporting documentation.

If you would like pricing, lead time, or to submit a request for quote, please request a quote or submit your RFQ to receive further purchasing and availability information.