EP3C5U256I7N

The EP3C5U256I7N is a Cyclone® III field programmable gate array (FPGA) in a 256‑LFBGA package designed for industrial applications. It provides 5,136 logic elements, approximately 0.424 Mbits of embedded memory and 182 user I/Os, making it suitable for mid‑density, I/O‑centric designs that require robust temperature and supply operation.

Built on the Cyclone III family architecture, the device targets low‑power, cost‑sensitive applications and offers family‑level features such as low static power operation and flexible clock management as documented in the device handbook.

Key Features

• Logic Capacity — 5,136 logic elements for mid‑range FPGA designs and flexible logic partitioning.
• Embedded Memory — Approximately 0.424 Mbits of on‑chip RAM to support buffering, FIFOs and small data stores without external memory.
• I/O Density — 182 user I/Os to support rich peripheral interfacing and parallel I/O requirements.
• Package & Mounting — 256‑LFBGA (supplier package: 256‑UBGA, 14×14); surface‑mount package suitable for compact PCB layouts.
• Voltage Supply — Operates from 1.15 V to 1.25 V, matching common FPGA core supply ranges.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for reliability in industrial environments.
• Low‑Power Family Characteristics — Cyclone III family emphasizes low power operation through process and silicon optimizations, enabling reduced power budgets for battery‑sensitive or thermally constrained designs.
• System Features (Family) — Cyclone III devices include integrated clock management resources (PLL support) and a high memory‑to‑logic ratio; consult the device handbook for detailed family capabilities.
• RoHS Compliant — Conforms to RoHS requirements for lead‑free assembly processes.

Typical Applications

• Industrial Control — Interfaces sensors, actuators and control logic with 182 I/Os and industrial temperature rating for factory and automation environments.
• Embedded Processing — Implements mid‑range custom logic and small embedded subsystems using the device’s 5,136 logic elements and on‑chip RAM for local buffering.
• I/O‑Centric Systems — Suits applications requiring many parallel interfaces, such as display controllers, data acquisition front ends or protocol bridging.
• Low‑Power, Cost‑Sensitive Designs — Leverages Cyclone III family low‑power characteristics for battery‑operated or thermally constrained products where reduced power and cost are priorities.

Unique Advantages

• Balanced Logic and Memory — 5,136 logic elements combined with approximately 0.424 Mbits of embedded memory provide a practical balance for mid‑density designs without external memory.
• High I/O Count — 182 user I/Os reduce the need for external I/O expanders and simplify board-level interface design.
• Industrial Reliability — −40 °C to 100 °C operating range and surface‑mount 256‑LFBGA packaging support robust deployment in industrial environments.
• Compact Package — 256‑UBGA (14×14) footprint enables compact PCB layouts for space‑constrained applications.
• Documented Low‑Power Architecture — Part of the Cyclone III family, which emphasizes low static power and power‑aware design flow to help meet tight power budgets.
• Standards and Compliance — RoHS compliance facilitates integration into modern, lead‑free manufacturing processes.

Why Choose EP3C5U256I7N?

The EP3C5U256I7N offers a practical combination of mid‑range logic capacity, on‑chip memory and a high I/O count in a compact 256‑LFBGA package tailored for industrial applications. Its operating voltage range of 1.15 V to 1.25 V, wide temperature rating and RoHS compliance make it a dependable choice for designs that require a balance of integration, power efficiency and environmental robustness.

This device is well suited to engineers developing industrial control, embedded processing and I/O‑intensive systems that benefit from the Cyclone III family’s low‑power characteristics and documented device features. Evaluate the EP3C5U256I7N when you need a mid‑density FPGA that integrates logic, memory and I/O in a production‑friendly package.

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