EP3C5U256I7
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 182 423936 5136 256-LFBGA |
|---|---|
| Quantity | 894 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-UBGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 182 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 321 | Number of Logic Elements/Cells | 5136 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 423936 |
Overview of EP3C5U256I7 – Cyclone® III FPGA, 256-LFBGA
The EP3C5U256I7 is a Cyclone® III field-programmable gate array (FPGA) in a 256-LFBGA package optimized for low-power, cost-sensitive designs. Based on the Cyclone III device family architecture, this device combines moderate logic capacity, embedded memory, and a high I/O count to address portable, industrial, and high-volume applications where power efficiency and integration matter.
This industrial-grade device provides 5,136 logic elements, approximately 0.4 Mbits of embedded memory, 182 user I/Os, and an operating range of −40°C to 100°C, with a supply voltage window of 1.15 V to 1.25 V—delivering the core building blocks needed for compact, low-power systems.
Key Features
- Logic Capacity 5,136 logic elements provide the programmable fabric for mid-range control, glue logic, and custom logic functions.
- Embedded Memory Approximately 0.4 Mbits of on-chip RAM supports buffering, FIFOs, and small data stores without external memory.
- I/O and Standards 182 user I/Os in a 256-LFBGA (256-UBGA 14×14) package enable flexible system interfacing; Cyclone III family devices support a broad set of I/O standards for mixed-signal interfaces.
- Clocking and Timing Family-level clock management features include up to four PLLs per device for robust clock synthesis and distribution.
- Power Envelope Designed on a TSMC low-power process with silicon and software optimizations to reduce static power consumption—suitable for energy-conscious designs within the specified 1.15 V to 1.25 V supply range.
- Package and Mounting Surface-mount 256-LFBGA package (256-UBGA, 14×14) supports compact board layouts and high-density integration.
- Industrial Temperature Rating Specified for operation from −40°C to 100°C for use in thermally challenging environments.
- Compliance RoHS compliant.
Typical Applications
- Portable and Handheld Devices Low static power characteristics and compact package support battery-powered products and thermally constrained designs.
- High‑Volume, Cost‑Sensitive Products Mid-range logic and on-chip memory make the device suitable for cost-optimized mass production where integration reduces BOM cost.
- Industrial Control and Monitoring Industrial temperature rating and flexible I/O support sensor interfacing, motor control logic, and embedded control functions.
- Embedded System Integration On-chip memory, PLLs, and family support for embedded processors and IP cores enable system control and peripheral aggregation in compact designs.
Unique Advantages
- Low-Power Process Technology Built on a low-power TSMC process with device- and software-level power optimizations to help meet tight power budgets.
- Balanced Integration Combines moderate logic (5,136 LEs), embedded memory, and 182 I/Os to reduce external components and simplify PCB design.
- Robust Clock Management Multiple PLLs at the family level enable flexible clock synthesis and distribution for diverse timing requirements.
- Industrial-Grade Operation Rated from −40°C to 100°C for reliable operation in demanding thermal environments.
- Compact Packaging 256-LFBGA (14×14 UBGA) package supports high-density, space-constrained applications.
- Supported Development Ecosystem Cyclone III family devices are supported by Quartus® II software and a wide collection of pre-built, verified IP cores to accelerate development.
Why Choose EP3C5U256I7?
The EP3C5U256I7 is positioned for designers who need a compact, low-power FPGA with a practical mix of logic, memory, and high I/O count for mid-range embedded and industrial applications. Its industrial temperature rating, narrow supply-voltage window, and RoHS compliance make it a reliable choice for systems that must balance power, integration, and environmental robustness.
Backed by Cyclone III family-level support—including clock-management resources and a rich IP ecosystem—the EP3C5U256I7 offers a scalable platform for fast time-to-market in high-volume, cost-sensitive designs.
If you would like pricing or availability, request a quote or submit an inquiry to receive a formal quote and lead-time information for EP3C5U256I7.

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