EP3C5U256I7

IC FPGA 182 I/O 256UBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 182 423936 5136 256-LFBGA

Quantity 894 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package256-UBGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O182Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs321Number of Logic Elements/Cells5136
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits423936

Overview of EP3C5U256I7 – Cyclone® III FPGA, 256-LFBGA

The EP3C5U256I7 is a Cyclone® III field-programmable gate array (FPGA) in a 256-LFBGA package optimized for low-power, cost-sensitive designs. Based on the Cyclone III device family architecture, this device combines moderate logic capacity, embedded memory, and a high I/O count to address portable, industrial, and high-volume applications where power efficiency and integration matter.

This industrial-grade device provides 5,136 logic elements, approximately 0.4 Mbits of embedded memory, 182 user I/Os, and an operating range of −40°C to 100°C, with a supply voltage window of 1.15 V to 1.25 V—delivering the core building blocks needed for compact, low-power systems.

Key Features

  • Logic Capacity  5,136 logic elements provide the programmable fabric for mid-range control, glue logic, and custom logic functions.
  • Embedded Memory  Approximately 0.4 Mbits of on-chip RAM supports buffering, FIFOs, and small data stores without external memory.
  • I/O and Standards  182 user I/Os in a 256-LFBGA (256-UBGA 14×14) package enable flexible system interfacing; Cyclone III family devices support a broad set of I/O standards for mixed-signal interfaces.
  • Clocking and Timing  Family-level clock management features include up to four PLLs per device for robust clock synthesis and distribution.
  • Power Envelope  Designed on a TSMC low-power process with silicon and software optimizations to reduce static power consumption—suitable for energy-conscious designs within the specified 1.15 V to 1.25 V supply range.
  • Package and Mounting  Surface-mount 256-LFBGA package (256-UBGA, 14×14) supports compact board layouts and high-density integration.
  • Industrial Temperature Rating  Specified for operation from −40°C to 100°C for use in thermally challenging environments.
  • Compliance  RoHS compliant.

Typical Applications

  • Portable and Handheld Devices  Low static power characteristics and compact package support battery-powered products and thermally constrained designs.
  • High‑Volume, Cost‑Sensitive Products  Mid-range logic and on-chip memory make the device suitable for cost-optimized mass production where integration reduces BOM cost.
  • Industrial Control and Monitoring  Industrial temperature rating and flexible I/O support sensor interfacing, motor control logic, and embedded control functions.
  • Embedded System Integration  On-chip memory, PLLs, and family support for embedded processors and IP cores enable system control and peripheral aggregation in compact designs.

Unique Advantages

  • Low-Power Process Technology  Built on a low-power TSMC process with device- and software-level power optimizations to help meet tight power budgets.
  • Balanced Integration  Combines moderate logic (5,136 LEs), embedded memory, and 182 I/Os to reduce external components and simplify PCB design.
  • Robust Clock Management  Multiple PLLs at the family level enable flexible clock synthesis and distribution for diverse timing requirements.
  • Industrial-Grade Operation  Rated from −40°C to 100°C for reliable operation in demanding thermal environments.
  • Compact Packaging  256-LFBGA (14×14 UBGA) package supports high-density, space-constrained applications.
  • Supported Development Ecosystem  Cyclone III family devices are supported by Quartus® II software and a wide collection of pre-built, verified IP cores to accelerate development.

Why Choose EP3C5U256I7?

The EP3C5U256I7 is positioned for designers who need a compact, low-power FPGA with a practical mix of logic, memory, and high I/O count for mid-range embedded and industrial applications. Its industrial temperature rating, narrow supply-voltage window, and RoHS compliance make it a reliable choice for systems that must balance power, integration, and environmental robustness.

Backed by Cyclone III family-level support—including clock-management resources and a rich IP ecosystem—the EP3C5U256I7 offers a scalable platform for fast time-to-market in high-volume, cost-sensitive designs.

If you would like pricing or availability, request a quote or submit an inquiry to receive a formal quote and lead-time information for EP3C5U256I7.

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