EP3C5U256C7N

The EP3C5U256C7N is a Cyclone® III family FPGA offering a compact, low-power programmable logic solution. Built on the Cyclone III architecture, it combines 5136 logic elements and approximately 0.424 Mbits of embedded memory with on-chip clock management to address cost- and power-sensitive designs.

This device is aimed at high-volume, commercially graded applications that require flexible I/O, moderate logic density, and low static power consumption. Typical uses include portable and consumer products as well as communication and interface processing where a surface-mount, small-package FPGA is required.

Key Features

• Logic Capacity — 5136 logic elements with 321 LABs (logic array blocks) to implement custom digital functions and glue logic.
• Embedded Memory — 423,936 bits of on-chip RAM (approximately 0.424 Mbits) for buffering, small FIFOs, and state storage.
• I/O Density and Standards — 182 user I/Os supporting a wide variety of industry I/O standards to accommodate diverse interface requirements.
• Low-Voltage Operation — Core supply range 1.15 V to 1.25 V designed for low-power system requirements.
• Clock Management — Family architecture provides on-chip PLLs for clock synthesis and distribution to support multi-clock designs.
• Compact Package — 256-LFBGA mounting in a surface-mount 256-UBGA (14×14) supplier package for space-constrained PCBs.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation to match typical commercial product environments.
• Regulatory — RoHS-compliant manufacturing.

Typical Applications

• Portable and Handheld Devices — Low-power operation and compact 256-LFBGA packaging make the device suitable for battery-powered and space-limited products.
• Consumer Electronics — Programmable logic and embedded memory enable custom control, user-interface processing, and peripheral bridging in consumer systems.
• Communications and Interfaces — High I/O count and on-chip clock management support protocol bridging, SERDES-less interface logic, and clock domain handling.
• High-Volume, Cost-Sensitive Designs — Cyclone III family architecture targets low static power and optimized cost for volume production requirements.

Unique Advantages

• Balanced Logic and Memory: 5136 logic elements paired with approximately 0.424 Mbits of embedded RAM provide capability for mixed control and data buffering tasks without external memory for many uses.
• High I/O Count: 182 I/Os allow direct interfacing to multiple peripherals and buses, reducing the need for external multiplexers or bridges.
• Low-Power Silicon Process: Cyclone III family optimizations and low-voltage core operation reduce static power, helping extend battery life and reduce cooling needs.
• Compact, Surface-Mount Package: 256-LFBGA (supplier 256-UBGA 14×14) enables dense PCB layouts while keeping the device in a manufacturable surface-mount form factor.
• Commercial Temperature Range: Rated 0 °C to 85 °C to match standard commercial product deployment scenarios.
• RoHS Compliance: Environmentally compliant manufacturing simplifies integration into consumer and commercial products with regulatory requirements.

Why Choose EP3C5U256C7N?

The EP3C5U256C7N positions itself as a compact, low-power Cyclone® III FPGA for commercial designs that need a balance of logic capacity, embedded memory, and plentiful I/O in a small surface-mount package. Its low-voltage core and family-level power optimizations make it suitable for cost- and power-sensitive products where integration and board-level space are priorities.

Designers targeting consumer, portable, and communications-related products will find this device useful for reducing BOM count and consolidating glue logic and interface tasks into a single programmable device while maintaining predictable operating conditions across the commercial temperature range.

Request a quote or submit an order inquiry to get pricing and availability for EP3C5U256C7N.