EP3C5U256A7N

The EP3C5U256A7N is a Cyclone® III family FPGA offering mid-range logic capacity in a compact 256-LFBGA package. It provides 5,136 logic elements, approximately 0.4 Mbits of embedded memory, and 182 user I/Os for system-level integration in cost- and power-sensitive designs.

Built on the Cyclone III device architecture, this device targets applications that need a balance of integration, low power, and I/O density, with automotive-grade qualification for use across demanding temperature ranges.

Key Features

• Logic Capacity — 5,136 logic elements suitable for mid-range programmable logic tasks and custom control functions.
• On-Chip Memory — 423,936 total RAM bits (approximately 0.4 Mbits) to support buffering, lookup tables, and small data structures on-chip.
• I/O Density — 182 I/O pins to interface with multiple peripherals, sensors, and external devices without external multiplexing.
• Low-Voltage Core — Core supply range of 1.15 V to 1.25 V to align with low-power system designs.
• Clocking & Timing — Cyclone III family architecture includes multiple phase-locked loops (PLLs) and clock-management features for robust clock synthesis and distribution.
• Package Options — 256-LFBGA (supplier device package: 256-UBGA, 14 × 14) for compact surface-mount board designs.
• Automotive Qualification — Grade: Automotive with AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C for automotive and similarly demanding environments.
• Regulatory Compliance — RoHS compliant for assembly and supply-chain compatibility.

Typical Applications

• Automotive Electronics — Control logic, sensor aggregation, and interface bridging in systems that require AEC-Q100 qualification and −40 °C to 125 °C operation.
• Low-Power Embedded Systems — Battery-powered and thermally constrained designs that benefit from Cyclone III family low-power architecture and a 1.15–1.25 V core supply.
• I/O-Intensive Control — Gateways, protocol bridges, and interface concentrators that need high I/O counts for connecting multiple peripherals or sensor arrays.

Unique Advantages

• Balanced Logic and Memory: 5,136 logic elements paired with approximately 0.4 Mbits of embedded memory eases partitioning of control, buffering, and data-path functions on a single device.
• High I/O Integration: 182 user I/Os reduce external components and PCB complexity for multi-sensor and multi-interface systems.
• Automotive-Ready Qualification: AEC-Q100 qualification and wide operating temperature range support deployment in automotive and other harsh-environment applications.
• Compact, Surface-Mount Package: 256-LFBGA (256-UBGA, 14 × 14) lets you deliver dense functionality in space-constrained PCB layouts.
• Power-Efficient Core: Low-voltage operation (1.15–1.25 V) aligns with power-sensitive designs and helps reduce system power consumption.
• Ecosystem Fit: As part of the Cyclone III family, the device benefits from device-level features such as on-chip PLLs and established IP support within the family architecture.

Why Choose EP3C5U256A7N?

The EP3C5U256A7N delivers a practical mix of logic density, embedded memory, and I/O capacity in a compact, automotive-qualified package. Its specifications make it well suited to engineers building mid-range programmable systems that require reliable operation across extended temperature ranges and low-voltage, power-conscious platforms.

Choose this Cyclone III device when you need a field-programmable solution that balances integration, automotive-grade robustness, and the architectural features of the Cyclone III family for streamlined system design and long-term deployment.

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