EP3C5M164I7

The EP3C5M164I7 is an Intel Cyclone III family FPGA offering 5,136 logic elements in a compact 164-TFBGA surface-mount package. As an industrial-grade device with a 1.15 V–1.25 V core supply and an operating range of −40 °C to 100 °C, it targets cost- and power-conscious embedded and industrial designs that require flexible programmable logic, on-chip memory, and a moderate I/O count.

Built on the Cyclone III device family architecture, this FPGA benefits from the family’s low-power optimization and integration features—delivering programmable logic, embedded memory, and system-level interfaces suitable for mid-range applications.

Key Features

• Logic Resources — 5,136 logic elements provide the configurable fabric for glue logic, custom datapaths, and moderate combinational/sequential logic designs.
• Embedded Memory — Approximately 0.424 Mbits of on-chip RAM for FIFOs, buffering, and local data storage without external memory.
• I/O Capacity — 106 user I/Os available for peripheral interfaces, sensor inputs, and board-level connectivity.
• Low-Voltage Core — Core supply range of 1.15 V to 1.25 V to support low-power system designs and modern power-rail architectures.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Package & Mounting — 164-TFBGA package (supplier package: 164-MBGA, 8×8) in a surface-mount form factor for dense PCB implementations.
• Family-Level System Features — As part of the Cyclone III family, the device benefits from low-power silicon and device-level features such as multiple PLLs for clock management and broad I/O standard support across the family.
• Compliance — RoHS-compliant manufacturing.

Typical Applications

• Industrial Control — Implement real-time control logic, protocol bridging, and deterministic I/O handling in factory automation and process control modules.
• Embedded Systems — Provide glue logic, custom peripheral interfaces, and local data buffering for compact embedded controllers and appliances.
• Communications & Networking — Handle packet preprocessing, custom interfacing, and timing-critical functions in mid-range networking equipment.
• Sensor Hubs & Data Acquisition — Aggregate sensor inputs, apply preprocessing, and route data to host processors using the device’s programmable logic and on-chip RAM.

Unique Advantages

• Balanced Logic and Memory: 5,136 logic elements combined with approximately 0.424 Mbits of embedded memory strike a balance for mid-range programmable tasks without the need for large external memory.
• Moderate I/O Count: 106 I/Os provide flexible interfacing options while keeping the package and board complexity manageable.
• Industrial Temperature Range: Rated −40 °C to 100 °C for deployment in industrial and thermally-challenging environments.
• Compact Surface-Mount Package: 164-TFBGA (164-MBGA, 8×8) enables a small PCB footprint for space-constrained designs.
• Low-Voltage Operation: 1.15 V–1.25 V core supply supports low-power system architectures and energy-efficient designs.
• Standards and Ecosystem (Family): As part of the Cyclone III family, designers can leverage family-level features and development resources for faster integration and deployment.

Why Choose EP3C5M164I7?

The EP3C5M164I7 delivers a practical combination of programmable logic, on-chip memory, and I/O in an industrial-grade Cyclone III package. It is well suited to engineers building mid-range embedded and industrial systems that require deterministic logic, local buffering, and moderate interfacing capabilities while working within constrained power and board-area budgets.

Choosing this FPGA gives you the scalability and ecosystem of the Cyclone III family—enabling reuse across designs and access to family-level capabilities while maintaining clear, verifiable specifications for voltage, temperature, package, and resource counts.

Request a quote or submit a purchase inquiry to obtain pricing and lead-time details for the EP3C5M164I7.