EP3C5F256I7N

The EP3C5F256I7N is a Cyclone® III family FPGA offering 5,136 logic elements in a 256-ball LFBGA package. Designed for cost- and power-sensitive embedded and industrial applications, it delivers a balance of integration, I/O capacity and low-power operation suitable for system-level functions such as control, I/O expansion and custom peripheral implementation.

As a member of the Cyclone III device family, this device benefits from silicon and software optimizations aimed at minimizing power consumption while enabling robust clocking and I/O options for a wide range of system designs.

Key Features

• Logic Capacity — 5,136 logic elements provide configurable logic for glue logic, custom state machines, and medium-complexity FPGA functions.
• Embedded Memory — 423,936 bits of on-chip RAM (approximately 0.42 Mbits) for data buffering, FIFOs, and small embedded storage needs.
• I/O Density — 182 user I/Os to support diverse external interfaces and multiple peripheral connections without extensive external glue logic.
• Power Supply — Core voltage support from 1.15 V to 1.25 V consistent with Cyclone III low-power operation characteristics.
• Clock Management — Benefits from Cyclone III family clock-management features, including multiple phase-locked loops for robust clock synthesis and distribution.
• Package & Mounting — 256-LBGA surface-mount package (supplier package: 256-FBGA 17×17) for compact PCB integration.
• Industrial Temperature — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• RoHS Compliant — Conforms to RoHS environmental requirements for lead-free assembly.

Typical Applications

• Industrial Control — Implement control loops, protocol translation, and supervisory logic using the device’s logic elements, on-chip RAM, and high I/O count under industrial temperature conditions.
• Embedded Systems — Use as a mid-density programmable fabric for custom I/O, peripheral aggregation, and application-specific acceleration in cost-sensitive designs.
• Communication Interfaces — Support multi-interface bridging, timing adaptation, and custom transceiver logic leveraging abundant I/Os and family clock-management features.
• Consumer and Portable Electronics — Integrate low-power Cyclone III capabilities where reduced static power and flexible I/O routing help meet system-level power and form-factor goals.

Unique Advantages

• Balanced Logic and Memory: 5,136 logic elements paired with approximately 0.42 Mbits of embedded RAM provide a practical mix for medium-complexity designs without excess cost.
• High I/O Count: 182 user I/Os reduce the need for external I/O expanders, simplifying PCB design and lowering BOM.
• Low-power Cyclone III Heritage: Leverages Cyclone III low-power process and device optimizations to help meet tighter power budgets in battery-powered or thermally constrained systems.
• Industrial Temperature Range: Specified for −40 °C to 100 °C operation, giving designers confidence for deployment in industrial applications.
• Compact, Surface-mount Package: 256-LBGA (256-FBGA 17×17 supplier package) enables dense board layouts for space-constrained products.
• Standards and Ecosystem: As part of the Cyclone III family, the device integrates with established development flows and device-level features for clocking and I/O management.

Why Choose EP3C5F256I7N?

The EP3C5F256I7N positions itself as a mid-density Cyclone III FPGA that combines a practical logic element count, significant on-chip RAM, and a large number of user I/Os in a compact industrial-temperature package. It is well suited to engineers seeking a cost- and power-conscious programmable fabric for embedded and industrial designs that require reliable I/O expansion, custom logic, and modest on-chip memory.

Choosing this device provides a scalable, supported FPGA option within the Cyclone III family—delivering predictable power and integration characteristics for designs that prioritize system-level efficiency and manufacturability.

If you would like pricing or availability, submit a request for a quote and our team will respond with details to support your design and procurement process.