EP3C5M164I7N

IC FPGA 106 I/O 164MBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 106 423936 5136 164-TFBGA

Quantity 406 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package164-MBGA (8x8)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case164-TFBGANumber of I/O106Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs321Number of Logic Elements/Cells5136
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits423936

Overview of EP3C5M164I7N – Cyclone III FPGA, 106 I/Os, 164-TFBGA

The EP3C5M164I7N is an Intel Cyclone III family Field Programmable Gate Array (FPGA) in a 164-TFBGA package. It delivers a mid-range combination of logic capacity, embedded memory, and I/O density tailored for low-power, cost-sensitive designs.

Built on the Cyclone III device architecture and rated for industrial operation, this device is suitable for applications that require modest logic density (5,136 logic elements), approximately 0.42 Mbits of embedded memory, and 106 user I/Os while operating across a wide temperature range.

Key Features

  • Core Logic  5,136 logic elements provide programmable fabric for glue logic, state machines, and moderate-density custom logic functions.
  • Embedded Memory  Approximately 0.42 Mbits (423,936 bits) of on-chip RAM to support buffering, FIFOs, and small data structures without external memory.
  • I/O Capacity and Standards  106 user I/Os support a broad collection of I/O standards (examples included across the Cyclone III family) to interface with diverse peripherals and subsystems.
  • Clock Management  Four PLLs per device with five outputs per PLL, supporting cascading and dynamic reconfiguration for flexible clock synthesis and distribution.
  • Low-Power Architecture  Part of the Cyclone III low-power family, leveraging TSMC low-power process technology and power-aware design flows to minimize static power consumption.
  • Packaging and Mounting  Surface-mount 164-TFBGA package (supplier package 164-MBGA, 8×8) for compact board-level integration.
  • Industrial Temperature Rating  Rated for operation from −40 °C to 100 °C and specified as industrial grade for reliable operation in thermally demanding environments.
  • System Reliability  Cyclone III family devices include reliability features such as CRC/check circuitry to detect configuration and single-event upset issues.
  • Tool and IP Support  Supported by the Cyclone III device family ecosystem, including pre‑built IP cores and Quartus II design flows, and availability of the Nios II embedded processor for embedded applications.
  • Power Supply  Core supply range 1.15 V to 1.25 V to match system power-rail design requirements.
  • RoHS Compliant  Device is RoHS compliant for environmental and regulatory considerations.

Typical Applications

  • Industrial Control  Logic consolidation, sensor interfacing, and I/O expansion in industrial equipment where extended temperature range and industrial grade components are required.
  • Portable and Handheld Devices  Battery-powered and handheld systems that benefit from Cyclone III low-power operation to extend battery life while providing programmable logic.
  • Communications and Networking  Mid-range networking functions, protocol bridging, and clock management where I/O density and multiple PLLs support timing and interface needs.
  • Embedded Systems  Custom control, data aggregation, and peripheral interface logic leveraging embedded memory and available Nios II soft-processor support.

Unique Advantages

  • Balanced Logic and Memory  5,136 logic elements paired with approximately 0.42 Mbits of embedded RAM provide the right balance for mid-range programmable designs without excessive BOM cost.
  • Flexible I/O Integration  106 user I/Os and broad I/O standard support simplify interfacing to diverse peripherals and reduce external translator components.
  • Compact, Industry-Ready Packaging  164-TFBGA surface-mount package enables compact board layouts while meeting industrial temperature requirements.
  • Clocking Flexibility  Multiple PLLs with cascade and dynamic reconfiguration options give designers precise control over system clocks and interface timings.
  • Low-Power Advantage  Cyclone III low-power architecture and process optimizations reduce static power, helping meet thermal and battery-life constraints.
  • Design Ecosystem  Access to Cyclone III family IP and Quartus II design tools accelerates development and shortens time-to-deployment.

Why Choose EP3C5M164I7N?

The EP3C5M164I7N is positioned as a practical, industrial-grade Cyclone III FPGA choice when you need a compact, low-power programmable solution with moderate logic and memory resources, ample I/O, and robust clock management. Its industrial temperature rating, RoHS compliance, and surface-mount 164-TFBGA package make it suitable for embedded and industrial applications where reliability and integration count.

Leveraging the Cyclone III family architecture and available design IP and tools, this device provides a straightforward platform for cost-sensitive, low-power systems that require on-chip logic, embedded RAM, and flexible interfacing without over-specifying resources.

Request a quote or submit an RFQ to receive pricing and availability for the EP3C5M164I7N and to discuss lead times for your production needs.

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