EP3C5U256C7

The EP3C5U256C7 is a Cyclone® III family FPGA offered by Intel, combining a low-power silicon process with a mid-range logic density and a high I/O count. This surface-mount device integrates 5,136 logic elements and approximately 0.4 Mbits of embedded memory, making it suitable for cost-sensitive, low-power applications that require flexible I/O and moderate on-chip logic and memory resources.

Typical use cases include portable and handheld designs, consumer and communications equipment where power efficiency, I/O flexibility, and compact packaging are priorities. The device operates from a 1.15 V to 1.25 V core supply and is specified for commercial temperature operation.

Key Features

• Logic Capacity — 5,136 logic elements to implement moderate-density digital logic and custom accelerators.
• Embedded Memory — 423,936 bits of on-chip RAM (approximately 0.4 Mbits) for buffering, FIFOs, and data storage close to logic.
• I/O Density and Standards — 182 I/Os to support complex board-level interfaces; the Cyclone III family supports standards including LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X, LVPECL, BLVDS, LVDS, mini-LVDS, RSDS, and PPDS.
• Clock Management — Four phase-locked loops (PLLs) per device with five outputs each for on-chip clock synthesis, distribution, and jitter management.
• Low-Voltage Operation — Core supply range of 1.15 V to 1.25 V consistent with the family’s low-power process technology.
• Package and Mounting — 256-LFBGA (256-UBGA, 14 × 14) package in a surface-mount form factor for compact PCB designs.
• Operating Range and Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS-compliant for environmental and manufacturing consistency.
• Family-Level Capabilities — Cyclone III family features include silicon and software optimizations for low power, and family variants provide additional security and integration options where required.

Typical Applications

• Portable and Handheld Devices — Low-power operation and modest logic/memory resources suit battery-powered instruments and mobile peripherals.
• Consumer Electronics — Use for interface bridging, custom control logic, or display and user-interface handling where compact packaging and many I/Os are needed.
• Communications and Networking — Implement protocol glue logic, packet buffering, and clock domain crossing using on-chip RAM and PLL resources.
• Embedded Processing — Support for embedded processor IP (family-level) enables offloading control tasks or integrating soft-core processors with peripheral logic.

Unique Advantages

• Balanced Logic and Memory — 5,136 logic elements paired with approximately 0.4 Mbits of embedded RAM provides a practical mix for mid-range designs without external memory.
• High I/O Count in a Compact Package — 182 user I/Os in a 256-LFBGA package reduce PCB area while maintaining board-level connectivity.
• Low-Power Silicon — Device leverages the Cyclone III family’s low-power process characteristics to support energy-efficient designs.
• Integrated Clock Resources — Four PLLs with multiple outputs simplify clocking schemes and reduce external timing components.
• Design Flexibility — Broad I/O standard support and on-chip resources enable diverse interface and timing configurations without extensive external circuitry.
• Environmentally Compliant — RoHS compliance supports regulatory and manufacturing preferences for lead-free assembly.

Why Choose EP3C5U256C7?

The EP3C5U256C7 positions itself as a pragmatic choice for designers needing a mid-density, low-power FPGA with strong I/O capability in a compact BGA package. Its combination of 5,136 logic elements, approximately 0.4 Mbits of embedded memory, 182 I/Os, and integrated PLLs supports a wide range of board-level functions while keeping power and part count down.

This device is well suited to designers targeting commercial-temperature applications that require a balance of integration, flexibility, and cost-effectiveness. Leveraging Cyclone III family optimizations and the available ecosystem of pre-built IP, it delivers a practical platform for scaling and sustaining product designs over time.

Request a quote or submit a procurement inquiry to get pricing and availability for EP3C5U256C7.