EP3C5U256C8

The EP3C5U256C8 is a Cyclone® III family field-programmable gate array (FPGA) in a 256-LFBGA package targeted at commercial applications. It delivers 5,136 logic elements, approximately 0.4 Mbits of embedded memory, and 182 user I/Os in a compact 14 × 14 256-ball BGA footprint.

Designed with low-power process technology and family-level silicon optimizations, this Cyclone III device suits cost- and power-sensitive designs that require moderate logic capacity, flexible I/O, and compact surface-mount packaging.

Key Features

• Logic Capacity — 5,136 logic elements provide programmable fabric for implementing custom logic, control, and glue-logic functions.
• Embedded Memory — Approximately 0.4 Mbits (423,936 bits) of on-chip RAM to support buffers, FIFOs, and small on-chip data storage.
• I/O Density — 182 user I/Os to interface with sensors, peripherals, and external devices while maintaining a compact package footprint.
• Voltage Supply — Core voltage range 1.15 V to 1.25 V to match typical Cyclone III power domains.
• Package & Mounting — 256-LFBGA (256-UBGA, 14×14) surface-mount package for high-density PCB integration.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Low-Power Family Characteristics — Based on Cyclone III family design emphasizing low power through process and silicon optimizations.
• Compliance — RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• Portable and Handheld Devices — Low-power Cyclone III characteristics help extend battery life in compact consumer and portable products.
• Consumer Electronics — Moderate logic capacity and high I/O count allow integration of control, user interface, and peripheral bridging in cost-sensitive designs.
• Embedded Control and Signal Glue Logic — On-chip RAM and programmable fabric enable custom control logic, protocol bridging, and signal conditioning tasks.
• Prototyping and Low- to Mid-Volume Systems — Compact BGA packaging and flexible I/O make the device suitable for proof-of-concept boards and volume designs where size and cost matter.

Unique Advantages

• Compact, High-I/O Package: 182 I/Os in a 256-LFBGA (14×14) footprint enable dense PCB routing and small form-factor designs.
• Balanced Logic and Memory: 5,136 logic elements combined with approximately 0.4 Mbits of embedded memory support a variety of control and buffering tasks without external SRAM for many applications.
• Low-Power Design Foundation: Cyclone III family-level low-power process and silicon optimizations reduce static power consumption for battery-powered and thermally constrained systems.
• Commercial Temperature Rating: Specified operation from 0 °C to 85 °C aligns with standard commercial electronics deployment environments.
• RoHS Compliant: Environmentally compliant manufacturing and deployment.
• Surface-Mount BGA Integration: 256-ball BGA packaging supports automated PCB assembly and compact system integration.

Why Choose EP3C5U256C8?

The EP3C5U256C8 provides a practical balance of programmable logic, on-chip memory, and a high I/O count in a compact 256-LFBGA package for commercial applications. Its Cyclone III family lineage brings low-power process advantages and design-level features suitable for cost- and power-sensitive designs that require reliable, surface-mount FPGA integration.

This device is well suited for engineers and procurement teams designing compact consumer, portable, and embedded systems that need moderate logic resources, flexible interfacing, and RoHS-compliant assembly.

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