EP3C80F484C6N
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 295 2810880 81264 484-BGA |
|---|---|
| Quantity | 962 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 295 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 5079 | Number of Logic Elements/Cells | 81264 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2810880 |
Overview of EP3C80F484C6N – Cyclone® III FPGA, 81,264 logic elements, approximately 2.81 Mbits embedded memory, 295 I/Os, 484-BGA
The EP3C80F484C6N is a Cyclone® III field programmable gate array (FPGA) optimized for high-functionality, low-power, cost-sensitive designs. As a member of the Cyclone III device family, it combines a substantial logic density with embedded memory and a high I/O count to address a variety of system-level roles.
This commercial-grade, surface-mount device targets high-volume, low-power applications where integration, flexible I/O, and controllable power consumption are key design drivers. It operates over a 1.15–1.25 V core supply range and a 0 °C to 85 °C ambient temperature range.
Key Features
- Core logic density — 81,264 logic elements to support complex digital designs and multiple concurrent functions on a single device.
- Embedded memory — Approximately 2.81 Mbits of on-chip RAM for buffering, packet processing, and embedded-data storage.
- High I/O count — 295 user I/Os to simplify external interfacing and reduce the need for additional bridge devices.
- Low-power architecture — Cyclone III family design emphasizes low power through process and silicon optimizations for battery-powered and thermally constrained systems.
- Clock management — Device-family support for multiple PLLs enables robust clock synthesis and distribution for system and interface timing (as described in Cyclone III device family features).
- Flexible I/O standards — Cyclone III family support for a wide range of I/O standards to accommodate diverse signaling requirements and simplify board-level integration.
- Package and mounting — 484-ball BGA (484-FBGA, 23 × 23) in a surface-mount package for compact, high-density PCB implementations.
- Commercial operating range — Rated for operation from 0 °C to 85 °C for general-purpose commercial applications.
- RoHS compliant — Environmentally compliant lead-free assembly.
Typical Applications
- Portable and handheld devices — Low-power Cyclone III architecture helps extend battery life while providing embedded memory and logic capacity for local processing and control.
- High-volume consumer electronics — High integration and a compact 484-BGA package suit size- and cost-sensitive consumer designs that require substantial logic and I/O.
- Interface bridging and I/O-rich systems — With 295 I/Os and broad I/O standard support, the device is suitable for protocol bridging, glue-logic, and front-end interfacing tasks.
Unique Advantages
- Balanced logic and memory resources: 81,264 logic elements paired with approximately 2.81 Mbits of embedded RAM lets you implement sizable data paths and buffering without external memory for many designs.
- High I/O flexibility: 295 I/Os reduce external components and simplify board routing for multi-interface systems.
- Low-power pedigree: Built on Cyclone III low-power family characteristics to help meet tight power budgets in portable and thermally constrained applications.
- Compact BGA package: 484-FBGA (23 × 23) enables dense PCB layouts and supports space-constrained product designs.
- Commercial-grade reliability: Specified for 0 °C to 85 °C operation and RoHS-compliant manufacturing for mainstream application deployment.
- Device-family ecosystem: Cyclone III family features—including device clock management and available IP—support integration into established FPGA design flows and toolchains.
Why Choose EP3C80F484C6N?
The EP3C80F484C6N positions itself as a practical choice for designers who need substantial logic capacity, meaningful on-chip memory, and a high I/O count in a low-power, cost-sensitive FPGA platform. Its Cyclone III family heritage delivers architecture-level features targeted at extending battery life, supporting diverse I/O standards, and simplifying system clocking.
This part is well suited for teams developing portable electronics, consumer products, and I/O-rich subsystems that benefit from integrated logic and memory while maintaining a compact BGA footprint. The combination of device resources, package density, and the Cyclone III device-family capabilities provides a scalable foundation for mid-range FPGA designs.
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