EP3C80F484C8
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 295 2810880 81264 484-BGA |
|---|---|
| Quantity | 151 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 295 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 5079 | Number of Logic Elements/Cells | 81264 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2810880 |
Overview of EP3C80F484C8 – Cyclone® III FPGA, 484-BGA, 81,264 logic elements
The EP3C80F484C8 is an Intel Cyclone® III family field-programmable gate array supplied in a 484-ball BGA package. It combines a mid-range logic capacity with on-chip memory and high I/O density for cost- and power-sensitive system designs.
Designed for high-volume, low-power, cost-conscious applications, this device provides a balance of logic resources, embedded RAM, clock management and I/O flexibility suitable for consumer, portable and communications-oriented products operating in commercial temperature environments.
Key Features
- Logic Capacity 81,264 logic elements for implementing complex digital functions and moderate to high-density designs.
- Embedded Memory Approximately 2.81 Mbits of on-chip RAM to support buffering, FIFOs and local data storage without external memory.
- I/O Resources 295 user I/Os to support wide interface integration and multiple external peripherals.
- Clock Management Four PLLs per device with multiple outputs for robust clock generation, phase shifting and clock-domain management.
- Low-Power Architecture Part of the Cyclone III family built on low-power process technology and silicon optimizations that target reduced static power consumption.
- Package & Mounting 484-BGA (supplier device package: 484-FBGA, 23 × 23) with surface-mount compatibility for PCB assembly.
- Power and Temperature Core voltage supply range of 1.15 V to 1.25 V; commercial operating temperature range 0 °C to 85 °C.
- Standards & I/O Features Family-level support for common I/O standards and features such as adjustable I/O slew rates and on-chip termination calibration to improve signal integrity across PVT.
- Compliance RoHS-compliant for environmentally conscious designs.
Typical Applications
- Portable and Handheld Devices Low-power Cyclone III architecture and embedded memory enable extended battery life and local data buffering for compact products.
- Consumer Electronics High I/O count and programmable logic support feature integration and interface bridging in media, display, and control applications.
- Communications & Networking On-chip PLLs and flexible I/O allow implementation of transceiver logic, protocol bridging and timing-critical functions.
- Embedded Processing Systems Sufficient logic and memory resources to implement custom accelerators, controllers or to host soft processors within the Cyclone III family.
Unique Advantages
- Balanced Logic-to-Memory Ratio 81,264 logic elements paired with approximately 2.81 Mbits of embedded RAM enable on-chip implementation of complex datapaths with local storage, reducing external memory needs.
- High I/O Density 295 user I/Os simplify board-level routing for multi-interface systems and reduce the need for external interface components.
- Integrated Clock Resources Four PLLs with multiple outputs provide flexible clock synthesis and distribution to simplify system timing design.
- Low-Power Foundation Built on a low-power process and device-level optimizations that help meet power budgets in thermally constrained designs.
- Compact BGA Package 484-BGA (484-FBGA, 23 × 23) enables a small board footprint while supporting high pin count.
- Commercial Temperature Rating Specified for 0 °C to 85 °C operation for mainstream electronics and consumer applications.
Why Choose EP3C80F484C8?
The EP3C80F484C8 positions itself as a versatile Cyclone III FPGA option for designers needing substantive logic capacity, embedded memory and a high I/O count in a low-power, cost-aware platform. Its combination of approximately 81k logic elements, roughly 2.81 Mbits of on-chip RAM and multiple PLLs makes it suitable for bridging, control, and data-path acceleration tasks in commercial products.
Choose this device when you need scalable programmability, robust clock management and a compact BGA package that supports dense system integration while maintaining RoHS compliance and a commercial operating range.
Request a quote or submit an inquiry to receive pricing and availability information for EP3C80F484C8. Our team can assist with lead times, volume pricing and any technical clarification you may need.

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