EP3C80F484C8

IC FPGA 295 I/O 484FBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 295 2810880 81264 484-BGA

Quantity 151 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O295Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5079Number of Logic Elements/Cells81264
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2810880

Overview of EP3C80F484C8 – Cyclone® III FPGA, 484-BGA, 81,264 logic elements

The EP3C80F484C8 is an Intel Cyclone® III family field-programmable gate array supplied in a 484-ball BGA package. It combines a mid-range logic capacity with on-chip memory and high I/O density for cost- and power-sensitive system designs.

Designed for high-volume, low-power, cost-conscious applications, this device provides a balance of logic resources, embedded RAM, clock management and I/O flexibility suitable for consumer, portable and communications-oriented products operating in commercial temperature environments.

Key Features

  • Logic Capacity  81,264 logic elements for implementing complex digital functions and moderate to high-density designs.
  • Embedded Memory  Approximately 2.81 Mbits of on-chip RAM to support buffering, FIFOs and local data storage without external memory.
  • I/O Resources  295 user I/Os to support wide interface integration and multiple external peripherals.
  • Clock Management  Four PLLs per device with multiple outputs for robust clock generation, phase shifting and clock-domain management.
  • Low-Power Architecture  Part of the Cyclone III family built on low-power process technology and silicon optimizations that target reduced static power consumption.
  • Package & Mounting  484-BGA (supplier device package: 484-FBGA, 23 × 23) with surface-mount compatibility for PCB assembly.
  • Power and Temperature  Core voltage supply range of 1.15 V to 1.25 V; commercial operating temperature range 0 °C to 85 °C.
  • Standards & I/O Features  Family-level support for common I/O standards and features such as adjustable I/O slew rates and on-chip termination calibration to improve signal integrity across PVT.
  • Compliance  RoHS-compliant for environmentally conscious designs.

Typical Applications

  • Portable and Handheld Devices  Low-power Cyclone III architecture and embedded memory enable extended battery life and local data buffering for compact products.
  • Consumer Electronics  High I/O count and programmable logic support feature integration and interface bridging in media, display, and control applications.
  • Communications & Networking  On-chip PLLs and flexible I/O allow implementation of transceiver logic, protocol bridging and timing-critical functions.
  • Embedded Processing Systems  Sufficient logic and memory resources to implement custom accelerators, controllers or to host soft processors within the Cyclone III family.

Unique Advantages

  • Balanced Logic-to-Memory Ratio  81,264 logic elements paired with approximately 2.81 Mbits of embedded RAM enable on-chip implementation of complex datapaths with local storage, reducing external memory needs.
  • High I/O Density  295 user I/Os simplify board-level routing for multi-interface systems and reduce the need for external interface components.
  • Integrated Clock Resources  Four PLLs with multiple outputs provide flexible clock synthesis and distribution to simplify system timing design.
  • Low-Power Foundation  Built on a low-power process and device-level optimizations that help meet power budgets in thermally constrained designs.
  • Compact BGA Package  484-BGA (484-FBGA, 23 × 23) enables a small board footprint while supporting high pin count.
  • Commercial Temperature Rating  Specified for 0 °C to 85 °C operation for mainstream electronics and consumer applications.

Why Choose EP3C80F484C8?

The EP3C80F484C8 positions itself as a versatile Cyclone III FPGA option for designers needing substantive logic capacity, embedded memory and a high I/O count in a low-power, cost-aware platform. Its combination of approximately 81k logic elements, roughly 2.81 Mbits of on-chip RAM and multiple PLLs makes it suitable for bridging, control, and data-path acceleration tasks in commercial products.

Choose this device when you need scalable programmability, robust clock management and a compact BGA package that supports dense system integration while maintaining RoHS compliance and a commercial operating range.

Request a quote or submit an inquiry to receive pricing and availability information for EP3C80F484C8. Our team can assist with lead times, volume pricing and any technical clarification you may need.

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