EP3C80F780C8N

The EP3C80F780C8N is an Intel Cyclone® III family FPGA offering a balance of high functionality and low-power operation for cost-sensitive, high-volume designs. It provides 81,264 logic elements and approximately 2.81 Mbits of embedded memory in a 780-FBGA (29×29) surface-mount package, making it suitable for systems that require significant logic capacity and dense I/O in a compact footprint.

Built on the Cyclone III device family architecture, this device targets applications that benefit from low static power, flexible clocking, and broad I/O capability while operating from a 1.15 V to 1.25 V core supply and across a commercial temperature range (0 °C to 85 °C).

Key Features

• Logic Capacity — 81,264 logic elements (LEs) to implement complex glue logic, protocol handling, or custom processing pipelines.
• Embedded Memory — Approximately 2.81 Mbits of on-chip RAM for buffering, FIFOs, and small data stores close to logic.
• High I/O Count — 429 user I/Os to support dense peripheral connectivity and multi-channel interfaces.
• Low-Power Process Technology — Cyclone III family devices are based on TSMC low-power (LP) process technology, designed to minimize static power for battery-powered and thermally constrained applications.
• Clock Management — Family architecture includes multiple PLLs for robust clock synthesis and distribution (four PLLs per device at the family level).
• Flexible I/O Standards — Cyclone III family supports a wide range of I/O standards, including LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X, LVPECL, BLVDS, LVDS, mini-LVDS, RSDS, and PPDS for broad interface compatibility.
• Package & Mounting — 780-ball FBGA (29×29) surface-mount package providing a compact, high-density solution for PCB integration.
• Commercial Grade — Rated for operation from 0 °C to 85 °C and RoHS compliant.
• Supply Voltage — Core voltage requirement between 1.15 V and 1.25 V.

Typical Applications

• Portable and Handheld Devices — Low-power design and reduced static power help extend battery life while providing programmable logic for feature-rich portable products.
• Consumer and High-Volume Electronics — Cost-sensitive, high-volume systems can leverage the Cyclone III family’s balance of functionality and low cost to integrate custom control and interface logic.
• Communications and Networking — High I/O count and on-chip memory enable interface aggregation, buffering, and protocol translation in compact network modules.
• Embedded Processing and IP Integration — Ample logic elements and memory support custom accelerators, glue logic, and integration of pre-built IP cores for system consolidation.

Unique Advantages

• Substantial Logic Density: 81,264 logic elements provide headroom for complex designs and multiple functional blocks on a single device.
• Integrated Memory Resources: Approximately 2.81 Mbits of embedded RAM reduce external memory needs and improve system performance by keeping data local to logic.
• Wide I/O Capability: 429 user I/Os accommodate dense peripheral connectivity and multi-channel interfaces without external multiplexing.
• Low-Power Platform: TSMC low-power process and family-level power-aware features help meet constrained power budgets in portable and thermally challenged systems.
• Compact, High-Density Packaging: 780-FBGA (29×29) surface-mount package minimizes PCB area while providing the I/O count required for complex systems.
• Commercial Readiness: Commercial temperature rating and RoHS compliance simplify integration into mainstream electronic products.

Why Choose EP3C80F780C8N?

The EP3C80F780C8N combines high logic capacity, meaningful on-chip memory, and an extensive I/O complement within a low-power Cyclone III family architecture. It is positioned for designers who need to consolidate multiple functions, implement custom processing or interface logic, and meet cost and power targets in commercial products.

Supported by the Cyclone III family feature set and Intel’s ecosystem, this device is suited to development teams and OEMs building scalable, reliable systems that require dense programmable logic in a compact surface-mount package.

Request a quote or submit a proposal to receive pricing and availability for EP3C80F780C8N for your next design.