EP3CLS150F484C7N

The EP3CLS150F484C7N is a Cyclone III family FPGA packaged in a 484-ball BGA (484-FBGA, 23×23) intended for commercial-grade, surface-mount applications. It integrates 150,848 logic elements and approximately 6.14 Mbits of embedded memory with 210 user I/Os to address high-volume, low-power, cost-sensitive designs.

Built on the Cyclone III device family architecture, this device targets applications requiring substantial logic and memory capacity within a compact BGA footprint while operating from a 1.15 V to 1.25 V supply and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Density  150,848 logic elements provide high logic capacity for complex FPGA implementations.
• Embedded Memory  Approximately 6.14 Mbits of on-chip RAM for data buffering, frame storage, and intermediate processing.
• I/O Capacity  210 user I/Os in a 484-BGA package enable extensive peripheral and bus interfacing in a compact assembly.
• Package and Mounting  484-FBGA (23×23) surface-mount package balances high pin-count routing with PCB area efficiency.
• Power Supply  Core voltage range of 1.15 V to 1.25 V to align with low-voltage power domains.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation, suitable for commercial and many industrial-adjacent environments.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.
• Cyclone III Family Capabilities  Based on Cyclone III architecture which emphasizes low power and high functionality, including family features such as multiple PLLs and high memory-to-logic ratios.

Typical Applications

• Communications and Networking  Protocol bridging, packet processing, and custom interface logic that benefit from high logic density and substantial on-chip memory.
• Consumer and Portable Electronics  Feature-rich, cost-sensitive devices where the Cyclone III family’s low-power characteristics and sizeable logic/memory resources are advantageous.
• Industrial Control and Automation  Custom control logic, I/O aggregation, and signal processing in systems operating within commercial temperature ranges.
• Test & Measurement  Data capture, pre-processing, and custom measurement logic that leverage the device’s memory and I/O count.

Unique Advantages

• High Logic Capacity: 150,848 logic elements enable integration of large custom logic functions and multi-module designs on a single device.
• Substantial On-Chip Memory: Approximately 6.14 Mbits of embedded RAM reduces external memory needs and simplifies board-level design.
• Generous I/O Support: 210 I/Os in a compact BGA package provide flexibility for wide buses and multiple peripheral interfaces.
• Compact, Standard Package: 484-FBGA (23×23) allows high pin count in a footprint suitable for automated surface-mount assembly.
• Low-Voltage Operation: 1.15 V–1.25 V core supply aligns with modern low-power system architectures to help manage power budgets.
• Commercial-Grade Reliability: Rated 0 °C to 85 °C for reliable operation across standard commercial environments.

Why Choose EP3CLS150F484C7N?

The EP3CLS150F484C7N positions itself where high logic density and meaningful on-chip memory must coexist with a compact BGA package and a low-voltage core. It is well suited to teams designing cost-sensitive, high-volume products that require significant logic and memory resources without expanding board area or relying heavily on external RAM.

Engineers can leverage the Cyclone III family architecture and device-level capacities to scale functionality, simplify BOMs, and maintain power efficiency in commercial-temperature applications while benefiting from RoHS compliance and standard surface-mount packaging.

If you’d like pricing, lead-time, or a formal quote for EP3CLS150F484C7N, submit a request or inquiry and our team will respond with the details you need.