EP3CLS150F484I7

The EP3CLS150F484I7 is a Cyclone® III family field programmable gate array (FPGA) in an industrial-grade, surface-mount 484-BGA (23×23) package. It combines high programmable logic capacity with on-chip embedded memory and multi-purpose I/O to address high-volume, low-power and integration-focused embedded designs.

Designed for systems requiring substantial logic density, sizable embedded RAM, and robust clock and I/O management, the device targets industrial and embedded applications where temperature range, low-voltage operation, and a rich feature set are important.

Key Features

• Logic Capacity: 150,848 logic elements providing substantial programmable logic resources for complex functions and wide integration of logic and glue logic.
• Embedded Memory: Approximately 6.1 Mbits of on-chip RAM (6,137,856 total RAM bits) to support large data buffers, FIFOs, and memory-mapped logic.
• I/O and Package: 210 user I/Os in a 484-FBGA (23×23) surface-mount package, enabling dense external interfacing and board-level routing flexibility.
• Low-Voltage Core: Core supply range 1.15 V to 1.25 V consistent with low-power family operation and modern power-rail architectures.
• Industrial Temperature Grade: Rated for operation from –40 °C to 100 °C and specified as Industrial grade for deployment in temperature-challenging environments.
• Clock Management: Four phase-locked loops (PLLs) per device with five outputs per PLL, supporting flexible clock synthesis and distribution for multiple domains.
• Signal Integrity & I/O Flexibility: Adjustable I/O slew rates, on-chip termination calibration (OCT), and support for a wide range of I/O standards enable reliable high-speed signalling and interface compatibility.
• System Reliability: Dedicated cyclical redundancy code (CRC) checker circuitry to help detect single-event upsets (SEU) and improve system visibility.
• Compliance: RoHS compliant for environmental regulatory alignment.

Typical Applications

• Industrial Control & Automation: High logic density and industrial temperature rating support motor control, real-time I/O aggregation, and factory automation functions.
• Embedded Processing & System Integration: Large on-chip memory and clock management capabilities suit embedded control, protocol bridging, and subsystem integration where a soft processor and IP cores may be used.
• High‑Density I/O Bridging: 210 I/Os and configurable I/O standards enable protocol conversion, board-level aggregation, and high-pin-count peripheral interfacing.
• Low‑Power Portable & Thermally Challenged Systems: Low-power family characteristics and low-voltage core operation support designs that must meet tight power budgets or operate in constrained thermal environments.

Unique Advantages

• Highly integrated solution: Large logic element count and several megabits of embedded memory reduce external components and simplify board-level design.
• Flexible clocking and timing: Multiple PLLs with multiple outputs enable precise clock domain creation and distribution without additional clock-management ICs.
• Robust I/O and signal integrity features: Adjustable slew rates and OCT calibration help maintain signal integrity across varied board and system conditions.
• Designed for demanding environments: Industrial temperature rating and surface-mount 484-BGA packaging support deployment in industrial and embedded applications.
• Built-in system reliability features: On-chip CRC/SEU detection and family-level provisions for power-aware, low-power operation improve system uptime and reduce thermal design needs.
• Ecosystem and IP support: Cyclone III family documentation notes availability of embedded processor options and pre-built IP, enabling faster integration and software/firmware development.

Why Choose EP3CLS150F484I7?

The EP3CLS150F484I7 positions itself as a high-density, low-power Cyclone III family FPGA suitable for engineers who require substantial programmable logic, multiple megabits of embedded RAM, flexible clocking, and a large I/O count in an industrial-rated package. Its combination of logic capacity, on-chip memory, and clock/I/O management makes it suitable for complex embedded subsystems, protocol bridging, and integration-focused designs.

For teams building scalable, robust systems where power, integration, and operating temperature are key considerations, this device offers a balance of resources and family-level features to accelerate development and reduce system BOM.

Request a quote or submit a sales inquiry to evaluate the EP3CLS150F484I7 for your next design.