EP3CLS150F780C8

The EP3CLS150F780C8 is a Cyclone® III family Field Programmable Gate Array IC from Intel, offering high logic capacity and embedded memory in a compact 780‑ball BGA package. Designed for high‑volume, low‑power, cost‑sensitive commercial applications, it provides a balance of integration, I/O density, and power efficiency for system and board designers.

With 150,848 logic elements, approximately 6.14 Mbits of embedded memory, and 413 user I/Os, this device is suited to applications that require substantial programmable logic, on‑chip memory, and dense I/O in a surface‑mount 780‑FBGA (29×29) package. The device operates at a core voltage range of 1.15 V to 1.25 V and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Architecture — Cyclone III family FPGA architecture that emphasizes low power and high functionality for cost‑sensitive designs, as described in the Cyclone III device handbook.
• Logic Capacity — 150,848 logic elements to implement large-scale programmable logic designs and complex control functions.
• Embedded Memory — Approximately 6.14 Mbits of on‑chip RAM to support buffering, data storage, and memory‑intensive functions without external memory.
• I/O Density — 413 user I/Os to support wide peripheral interfacing and parallel interfaces on a single device.
• Clock Management — Family features include multiple phase‑locked loops (PLLs) for robust clock synthesis and distribution (Cyclone III family specification).
• Power and Voltage — Core voltage specified at 1.15 V to 1.25 V; family focus on low static power consumption for battery‑sensitive and thermally constrained designs.
• Package & Mounting — Surface‑mount 780‑BGA package (supplier package: 780‑FBGA, 29×29), enabling compact board integration with high pin count.
• Operating Conditions — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS‑compliant for environmental and manufacturing process requirements.

Typical Applications

• Portable and Handheld Devices — Low‑power Cyclone III architecture and on‑chip memory help extend battery life while supporting complex logic and control functions.
• Consumer Electronics — High logic and I/O density enable integration of display controllers, I/O bridges, and custom peripherals in compact product designs.
• Communications Equipment — Large logic capacity and plentiful I/Os support protocol processing, data buffering, and interface aggregation in commercial networking gear.
• Embedded Processing and Prototyping — Ample logic elements and memory make the device suitable for implementing custom accelerators, state machines, and prototype system designs.

Unique Advantages

• High Logic Integration: 150,848 logic elements allow consolidation of multiple functions onto a single FPGA, reducing external components and simplifying board design.
• On‑Chip Memory Resources: Approximately 6.14 Mbits of embedded RAM reduce dependency on external memory for buffering and data paths, improving system performance and design simplicity.
• Dense I/O Capability: 413 user I/Os accommodate broad peripheral connectivity and high‑bandwidth parallel interfaces without additional multiplexing logic.
• Compact, Surface‑Mount Package: 780‑FBGA (29×29) package delivers high pin count in a space‑efficient footprint for modern PCB layouts.
• Commercial‑Grade Operating Range: Designed for standard commercial environments with specified 0 °C to 85 °C operation and RoHS compliance for manufacturing compatibility.
• Low‑Power Family Characteristics: Cyclone III family emphasis on low static power supports thermally constrained and battery‑powered applications.

Why Choose EP3CLS150F780C8?

The EP3CLS150F780C8 combines substantial logic capacity, significant on‑chip memory, and a high I/O count in a compact 780‑BGA surface‑mount package, making it a strong choice for commercial designs that require integration and power efficiency. Its Cyclone III family architecture provides proven low‑power characteristics and system‑level features such as clock management that help streamline implementation of complex, high‑I/O applications.

This device is well suited to designers building high‑volume, cost‑sensitive products who need a balance of programmable logic, embedded memory, and dense I/O in a RoHS‑compliant, commercially graded FPGA.

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