EP3CLS150F780I7N

The EP3CLS150F780I7N is a Cyclone® III field programmable gate array (FPGA) offered in a 780-ball fine-pitch BGA package. It provides 150,848 logic elements and approximately 6.14 Mbits of embedded memory, combined with 413 user I/Os for designs that require high integration and flexible external interfacing.

As a member of the Cyclone III device family, this device aligns with the family's low-power, high-functionality design goals and is specified for industrial-grade operation across a wide temperature range and a nominal core supply between 1.15 V and 1.25 V.

Key Features

• Core Capacity  150,848 logic elements organized across 9,428 logic blocks provide substantial programmable fabric for complex custom logic and glue-logic integration.
• Embedded Memory  Approximately 6.14 Mbits of on-chip RAM supports buffers, FIFOs, and small on-chip data stores without external memory.
• High I/O Count  413 user I/Os enable extensive external connectivity for sensors, peripherals, and multi-channel interfaces.
• Clock Management  Cyclone III family devices support robust clock management, including dedicated PLL resources for flexible clocking and synthesis in system designs.
• Power  Designed to operate from a core voltage of 1.15 V to 1.25 V, consistent with Cyclone III family low-power process technology.
• Package & Mounting  780-ball FBGA (29 × 29) package in a surface-mount form factor for compact, high-density PCB layouts.
• Industrial Grade  Specified for operation from –40 °C to 100 °C, meeting industrial temperature requirements for deployed systems.
• Family-Level Integration  As part of the Cyclone III family, designers can leverage family features such as Nios® II embedded processor support and a wide collection of pre-built IP cores.

Typical Applications

• Portable and Handheld Systems  Low-power family characteristics help extend battery life and reduce thermal requirements in portable designs.
• Industrial Control and Automation  Industrial temperature rating and high I/O density suit motor control, sensor interfacing, and PLC-style applications.
• Embedded Processing and Custom Logic  Large logic and memory resources support custom accelerators, protocol offload, and integration of soft processors such as Nios® II within Cyclone III family devices.
• I/O-Intensive Interfaces  413 user I/Os enable complex front-end interfacing, multi-channel data acquisition, and I/O-rich communication bridges.

Unique Advantages

• High Integration Density: Combine 150,848 logic elements and ~6.14 Mbits of embedded memory to reduce external components and simplify system BOM.
• Extensive External Connectivity: 413 user I/Os provide the pin bandwidth needed for multi-interface and multi-peripheral designs.
• Industrial Reliability: Specified operation from –40 °C to 100 °C supports deployment in temperature-challenging environments.
• Compact Packaging: 780-FBGA (29 × 29) surface-mount package delivers high I/O count in a space-efficient footprint for dense PCBs.
• Power-Sensitive Design: Core voltage of 1.15 V–1.25 V aligns with the Cyclone III family’s low-power approach for lower static and dynamic power consumption.
• Design Ecosystem: Compatibility with Cyclone III family IP and tools enables reuse of verified IP and design flows for faster time to market.

Why Choose EP3CLS150F780I7N?

The EP3CLS150F780I7N combines a high logic count, multi-megabit on-chip memory, and a large complement of I/Os in an industrial-grade, surface-mount 780-FBGA package. It is targeted at applications that require significant on-chip logic and memory capacity while maintaining compact physical size and industrial temperature robustness.

This part is well suited for design teams building embedded systems, I/O-dense interfaces, or industrial control equipment who need the integration benefits and family-level ecosystem of Cyclone III devices.

Request a quote or submit a purchase inquiry to evaluate the EP3CLS150F780I7N for your next design.