EP3CLS150F780C8N

The EP3CLS150F780C8N is a Cyclone® III family field programmable gate array (FPGA) from Intel, delivering large logic capacity and embedded memory in a compact 780-ball BGA package. Built on the Cyclone III device architecture, it targets high‑volume, low‑power, cost‑sensitive designs that require significant on‑chip logic, memory and I/O integration.

With 150,848 logic elements, approximately 6.14 Mbits of embedded memory and 413 I/O pins, this surface‑mount FPGA is suited to applications that need dense logic and flexible I/O in a commercial‑grade device operating from 0 °C to 85 °C and a core supply of 1.15 V to 1.25 V.

Key Features

• Logic Capacity — 150,848 logic elements provide large-scale programmable logic resources for complex algorithms and parallel processing.
• Embedded Memory — Approximately 6.14 Mbits of on‑chip RAM to support buffers, FIFOs and data storage without external memory.
• I/O Density & Flexibility — 413 user I/Os in a 780‑BGA footprint enable dense external connectivity and interface consolidation.
• Low‑Power Family Architecture — Based on Cyclone III device family low‑power process and silicon optimizations for efficient operation in power‑sensitive applications.
• Clock Management — Cyclone III family devices include multiple PLLs (four PLLs per device, five outputs per PLL) for robust clock synthesis, cascading and dynamic reconfiguration.
• Broad I/O Standard Support — Family‑level support for common single‑ended and differential standards such as LVTTL, LVCMOS, SSTL, HSTL, PCI/PCI‑X, LVPECL, LVDS and BLVDS to simplify board‑level interfacing.
• Package & Mounting — 780‑FBGA (29 × 29 mm) surface‑mount package balances high I/O count with compact PCB footprint.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C suitable for a wide range of consumer and industrial‑adjacent applications.
• RoHS Compliant — Meets environmental requirements for lead‑free assembly and regulatory compliance.

Typical Applications

• Portable and Handheld Electronics — Low‑power Cyclone III architecture and substantial on‑chip memory support battery‑sensitive designs and compact systems.
• Embedded Processing and Control — High logic density and integrated memory are suitable for system control, protocol handling and custom processing pipelines.
• High‑I/O Interface Hubs — 413 I/Os and support for common standards enable bridging, protocol conversion, and multi‑interface gateway functions.
• Communication and Networking Equipment — Dense logic and PLL‑based clock management help implement timing, packet processing and interface aggregation in space‑constrained PCBs.

Unique Advantages

• Extensive On‑Chip Resources: 150,848 logic elements and approximately 6.14 Mbits of embedded memory reduce reliance on external components and simplify BOM.
• Versatile I/O Connectivity: 413 I/Os and broad standard support allow direct interfacing with a wide variety of peripherals and signaling standards.
• Compact, High‑Density Package: 780‑FBGA (29×29 mm) package delivers high pin count in a compact footprint for space‑constrained designs.
• Power‑Aware Family Design: Cyclone III family optimizations lower static power consumption, supporting thermally constrained and battery‑operated systems.
• Robust Clocking Options: Multiple PLLs with cascaded and dynamic reconfiguration features enable precise clocking and flexible timing architectures.
• Commercial‑Grade Reliability: Rated for 0 °C to 85 °C and RoHS compliant for mainstream product deployments.

Why Choose EP3CLS150F780C8N?

The EP3CLS150F780C8N combines the Cyclone III family’s low‑power architecture with a high logic count, substantial embedded memory and a large I/O complement in a compact 780‑BGA package. It is positioned for engineers who need a cost‑effective, high‑capacity FPGA for applications that require on‑chip memory, flexible interfacing and predictable commercial‑grade operating conditions.

This part is appropriate for design teams focused on scalability and integration—reducing external BOM, consolidating interfaces and leveraging family‑level clocking and I/O capabilities to accelerate time to market while maintaining energy efficiency.

Request a quote or submit a quote today to discuss pricing and availability for EP3CLS150F780C8N and to get assistance matching this FPGA to your project requirements.