EP3CLS150F780C7

The EP3CLS150F780C7 is a Cyclone® III family field programmable gate array (FPGA) offered in a 780‑ball BGA package. It delivers 150,848 logic elements and approximately 6.14 Mbits of embedded memory, making it suitable for high‑density, cost‑sensitive designs that require substantial on‑chip logic and memory resources.

Built on the Cyclone III device family architecture, this device targets high‑volume, low‑power applications and provides a balance of integration, I/O capacity and power efficiency for commercial‑grade systems operating between 0 °C and 85 °C.

Key Features

• High logic density — 150,848 logic elements support complex custom logic and large combinational/sequential designs.
• Embedded memory — Approximately 6.14 Mbits of on‑chip RAM for buffering, lookup tables and embedded data storage.
• Generous I/O — 413 user I/Os accommodate wide bus interfaces, multiple peripherals and high‑pin-count designs.
• Power supply — Operates from 1.15 V to 1.25 V supply rails consistent with Cyclone III low‑power operation.
• Package and mounting — 780‑ball FBGA (29 × 29) surface‑mount package for compact board integration and reliable solder attach.
• Commercial temperature grade — Specified for 0 °C to 85 °C operation for mainstream electronic products.
• Cyclone III family capabilities — Family features include low‑power silicon optimizations, multi‑phase PLLs for clock management, and a high memory‑to‑logic ratio to support integration and system consolidation.
• RoHS compliant — Meets RoHS environmental requirements for lead‑free assembly.

Typical Applications

• Portable and handheld devices — Low‑power family characteristics help extend battery life while providing substantial logic and memory for device control and processing.
• Consumer and cost‑sensitive electronics — High logic density and on‑chip memory enable integration of multiple functions into a single, low‑cost FPGA solution.
• Communications and interface bridging — Large I/O count and flexible I/O support make the device suitable for protocol bridging, data aggregation and interface adaptation tasks.
• Embedded processing and custom accelerators — Ample logic and memory resources support embedded soft‑processor implementations and application‑specific logic accelerators within commercial systems.

Unique Advantages

• Substantial on‑chip resources: 150,848 logic elements and ~6.14 Mbits of embedded RAM reduce the need for external components and simplify board design.
• High I/O capacity: 413 user I/Os support complex connectivity and minimize external multiplexing or glue logic.
• Compact, manufacturable package: 780‑ball FBGA (29 × 29) provides a compact footprint and industry‑standard surface‑mount assembly.
• Designed for low power: Part of the Cyclone III family built on low‑power process technology to help meet tight power budgets in volume products.
• Commercial readiness: Commercial temperature rating and RoHS compliance align the device with mainstream electronics production and environmental requirements.
• Clocking and system integration: Cyclone III family clock management features (including multi‑phase PLLs) enable flexible system clocking and interface timing control.

Why Choose EP3CLS150F780C7?

The EP3CLS150F780C7 combines high logic density, substantial embedded memory and a large I/O complement in a compact 780‑FBGA package, making it a practical choice for designers of high‑volume, low‑power commercial products. Its placement within the Cyclone III family means you benefit from a device architecture focused on power efficiency and system integration.

This FPGA is well suited to teams that need to consolidate functionality, reduce external components and maintain manufacturability across standard commercial temperature ranges while leveraging family‑level features for clock management and on‑chip memory utilization.

Request a quote or submit an inquiry to check pricing and availability for EP3CLS150F780C7 and to discuss how this Cyclone III FPGA can fit your next design.