EP3CLS150F780I7

The EP3CLS150F780I7 is a Cyclone® III Field Programmable Gate Array (FPGA) offering high logic density and integrated on‑chip memory in a 780‑ball FBGA package. It targets high‑volume, low‑power, cost‑sensitive designs and applications that require significant programmable logic, large embedded memory, and a high I/O count.

Built on the Cyclone III device family architecture, the device combines a low‑power process approach with device‑level features intended to reduce system power and simplify integration. Key device specifications include 150,848 logic elements, approximately 6.14 Mbits of embedded memory, 413 I/Os, a 1.15–1.25 V supply range, and an industrial operating range of −40 °C to 100 °C.

Key Features

• Programmable logic density — 150,848 logic elements provide capacity for complex, large‑scale logic designs while the device listing also indicates 9,428 LABs.
• Embedded memory — approximately 6.14 Mbits of on‑chip RAM (6,137,856 bits) to support buffering, lookup tables, and data‑intensive logic functions.
• High I/O integration — 413 user I/Os support wide connectivity and interface options for complex systems.
• Package and mounting — 780‑FBGA (29×29) surface‑mount package (780‑BGA package case) for compact board integration.
• Power and supply — low‑voltage core operation with a supply range of 1.15 V to 1.25 V to align with low‑power system designs.
• Industrial operating range — rated for −40 °C to 100 °C operation for deployment in industrial temperature environments.
• Family‑level low‑power architecture — Cyclone III device family uses a low‑power process and device optimizations to minimize static power consumption for battery‑sensitive and thermally constrained applications.
• Clocking and system integration (device family) — Cyclone III family devices include robust clock management features such as multiple PLLs, cascaded outputs, and dynamic reconfiguration capability to support diverse timing architectures.
• I/O standards and signal integrity (device family) — family supports a wide range of I/O standards and options to address signal‑integrity and interface requirements in varied system designs.
• Compliance — RoHS compliant.

Typical Applications

• High‑volume, cost‑sensitive products — suited for designs that require a balance of functionality and low cost in large production runs.
• Portable and handheld devices — low‑power device family characteristics help extend battery life in compact systems.
• Embedded systems and custom logic — on‑chip memory and high logic capacity enable complex control, preprocessing, and protocol handling within a single FPGA.
• I/O‑rich systems — applications requiring many external interfaces benefit from the device’s 413 I/Os and family‑level support for diverse I/O standards.

Unique Advantages

• High logic capacity: 150,848 logic elements enable large designs and integration of multiple functions on one device.
• Substantial embedded memory: approximately 6.14 Mbits of on‑chip RAM reduces the need for external memory in many applications.
• Extensive I/O: 413 I/Os provide flexibility for multi‑interface systems and dense connectivity.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in industrial environments.
• Low‑voltage core operation: 1.15–1.25 V supply supports low‑power system design targets.
• Compact BGA footprint: 780‑FBGA (29×29) package enables high‑density PCB layouts while maintaining robust board mounting.

Why Choose EP3CLS150F780I7?

The EP3CLS150F780I7 positions itself as a high‑density, low‑power FPGA choice within the Cyclone III family, combining large logic resources, significant embedded memory, and a high I/O count in a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for a range of industrial and commercial products where reliability and regulatory compliance matter.

This device is suited for design teams building cost‑sensitive, high‑volume systems that require on‑chip memory and extensive programmable logic. Leveraging Cyclone III family architectural features and available device‑level capabilities helps reduce board‑level complexity and supports streamlined integration into production designs.

Request a quote or submit an inquiry to discuss availability, pricing, and how EP3CLS150F780I7 fits your next design.