EP3CLS200F484C7

The EP3CLS200F484C7 is a Cyclone® III family field-programmable gate array (FPGA) designed for commercial applications that require high logic density with low power consumption. Built on the Cyclone III architecture, this device delivers a large programmable fabric, substantial on-chip memory, and flexible I/O capability in a compact 484-ball FBGA package.

Targeted at high-volume, cost- and power-sensitive designs, the device is suited for applications that need significant logic resources, embedded memory, and robust clock management while operating within a standard commercial temperature range.

Key Features

• High-density logic fabric — 198,464 logic elements provide extensive programmable resources for complex digital functions and custom logic implementation.
• Substantial embedded memory — Approximately 8.21 Mbits of on-chip RAM for frame buffers, FIFOs, and data storage without external memory.
• Generous I/O count — 210 user I/Os to interface with sensors, peripherals, and high-pin-count system connections.
• Low-voltage core — Core voltage supply range of 1.15 V to 1.25 V to match modern low-power system rails.
• Commercial temperature grade — Rated for 0 °C to 85 °C operation for mainstream commercial deployments.
• Compact surface-mount package — 484-FBGA (23×23) package provides high pin density in a board-friendly form factor.
• Low-power family architecture — Cyclone III family design emphasizes low static power through process and silicon optimizations.
• Robust clock management — Family-level clock features include multiple PLLs for flexible clock generation and distribution (as described in the Cyclone III device family documentation).
• Wide I/O standard support — Family-level I/O support includes common standards for interfacing diverse subsystems (as described in the Cyclone III device family documentation).

Typical Applications

• High-density logic acceleration — Implement complex custom logic, protocol bridges, and FPGA-based accelerators that benefit from nearly 200K logic elements.
• Embedded memory buffering — Use the approximately 8.21 Mbits of on-chip RAM for video/frame buffering, packet buffering, and real-time data queues.
• System I/O aggregation — Consolidate multiple sensor and peripheral interfaces using the device’s 210 I/Os to reduce system component count.
• Low-power portable equipment — Deploy in battery-sensitive or thermally constrained products that benefit from the Cyclone III low-power architecture and 1.15–1.25 V core supply.

Unique Advantages

• High integration density: 198,464 logic elements and large embedded RAM reduce the need for external logic and memory, simplifying BOM and PCB routing.
• Compact, high-pin-count package: The 484-FBGA (23×23) surface-mount package delivers substantial I/O and signal routing capability in a space-efficient footprint.
• Power-efficient operation: Cyclone III family low-power design and the device’s low core-voltage range help minimize static and dynamic power in system designs.
• Commercial-ready thermal range: Rated for 0 °C to 85 °C operation to meet mainstream commercial product requirements.
• Flexible clocking and interfaces: Family-level PLL and I/O capabilities support complex clocking schemes and diverse interface standards for system-level integration.

Why Choose EP3CLS200F484C7?

The EP3CLS200F484C7 combines very high logic capacity with substantial embedded memory and a high I/O count in a compact 484-FBGA package, making it a strong fit for commercial designs that require dense programmable logic and on-chip RAM while maintaining a low-power profile. Its operating voltage range and commercial temperature rating align with mainstream system architectures and power rails.

Engineers developing high-volume, cost-sensitive products will find the Cyclone III family characteristics—low power, flexible clocking, and broad I/O support—helpful for scaling designs, reducing external components, and accelerating time to market.

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