EP3CLS200F484C8N

The EP3CLS200F484C8N is an Intel Cyclone® III field-programmable gate array (FPGA) offered in a 484-ball FBGA package. It integrates 198,464 logic elements and approximately 8.21 Mbits of embedded memory, delivering a high-functionality, low-power programmable fabric for cost-sensitive designs.

Designed for applications that require a balance of integration, I/O density and energy efficiency, this Cyclone III device is suitable for portable and high-volume systems that operate within a commercial temperature range.

Key Features

• Logic Capacity  198,464 logic elements (cells) provide substantial programmable resources for complex custom logic and system integration.
• Embedded Memory  Approximately 8.21 Mbits of on-chip RAM to support buffering, state machines and local data storage without external memory.
• I/O Count & Flexibility  210 user I/Os support diverse interface requirements; device family supports multiple I/O standards including LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI‑X, LVPECL, BLVDS, LVDS, mini‑LVDS, RSDS, and PPDS.
• Power Supply  Core voltage operation between 1.15 V and 1.25 V, enabling low-power operation in energy-conscious designs.
• Low-Power Family Attributes  Cyclone III family characteristics emphasize low static power through TSMC low-power process technology and power-aware silicon/software optimizations.
• Clock Management  Family-level PLL resources and clock-management features (as documented in the Cyclone III handbook) enable robust clock synthesis and distribution for complex systems.
• Package & Mounting  484‑FBGA (23 × 23) surface-mount package optimized for compact board layouts and high pin density.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for typical commercial applications.
• RoHS Compliant  Meets RoHS requirements for environmental compliance.

Typical Applications

• Portable and Handheld Devices  Low-power Cyclone III attributes help extend battery life while providing programmable logic and embedded memory for application-specific functions.
• Consumer and High-Volume Electronics  High logic density and integrated memory make the device suitable for feature-rich, cost-sensitive consumer products.
• Networking & Communications  Large I/O count and programmable interfaces support protocol bridging, packet processing and custom I/O adaptation.
• Embedded Processing & Custom IP  Substantial logic and memory capacity enables implementation of custom accelerators, control logic and soft-core processors.

Unique Advantages

• High Logic and Memory Integration: Combines 198,464 logic elements with approximately 8.21 Mbits of embedded RAM to consolidate functions that would otherwise require multiple devices.
• Broad I/O Flexibility: 210 I/Os and support for a wide range of interface standards reduce external level-shifting and simplify board-level design.
• Compact, High-Density Package: 484‑FBGA (23 × 23) provides a high pin count in a compact surface-mount footprint to save PCB area.
• Power-Conscious Operation: Core voltage range of 1.15–1.25 V and family-level low-power process optimizations help meet thermal and battery constraints.
• Commercial Temperature Support: Rated 0 °C to 85 °C to match mainstream commercial application requirements.
• Standards and Compliance: RoHS compliance supports environmental and regulatory needs for many product lines.

Why Choose EP3CLS200F484C8N?

The EP3CLS200F484C8N positions itself as a highly integrated, low-power Cyclone III FPGA option for designers targeting cost-sensitive, high-volume, and portable applications. With nearly 200k logic elements, multi-megabit on-chip RAM and 210 user I/Os in a compact 484‑FBGA package, it enables substantial system consolidation and flexible I/O implementation without excessive board-level complexity.

Ideal for teams building consumer electronics, embedded systems, or communications equipment that need programmable performance with commercial-temperature operation and environmental compliance, this device leverages Cyclone III family features to deliver dependable, scalable capability and supportable long-term designs.

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