EP3CLS200F484I7

The EP3CLS200F484I7 is an Intel Cyclone® III field-programmable gate array (FPGA) supplied in a 484-ball BGA package with a 23×23 FBGA footprint. Designed for industrial-grade systems, this device delivers high logic density and substantial on‑chip memory while operating from a low core voltage across a wide temperature range.

As a Cyclone III family device, it benefits from the family’s low-power silicon and architecture optimizations targeted at high-volume, cost- and power-sensitive applications, while supporting a broad set of system-level features from the Cyclone III device handbook.

Key Features

• High Logic Density — 198,464 logic elements provide capacity for large, complex designs and multi-function integration.
• Embedded Memory — Approximately 8.2 Mbits of on-chip RAM for buffering, state storage, and data processing tasks.
• I/O Count — 210 user I/O pins to support a wide range of external interfaces and board-level connectivity.
• Power and Supply — Core voltage specified from 1.15 V to 1.25 V to match system power rails and power-management strategies.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Package and Mounting — 484-BGA package (supplier package: 484-FBGA, 23×23) with surface-mount mounting for compact PCB implementation.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free systems.
• Cyclone III Family Benefits — Inherits Cyclone III family attributes such as low-power process technology and a collection of verified IP cores and system features described in the Cyclone III device handbook.

Typical Applications

• Industrial Control — Use for complex control logic, signal aggregation, and interface bridging in industrial systems that require an industrial temperature rating.
• High‑Density Data Processing — On-chip memory and large logic element count support buffering, packet processing, and custom data-path implementations.
• Battery‑Sensitive and Portable Systems — Family-level low-power characteristics make this device suitable for applications where power efficiency and extended battery life are important.
• Embedded System Integration — Suitable for designs that require integration of IP cores and embedded processing functions from the Cyclone III ecosystem.

Unique Advantages

• Large Logic Capacity: 198,464 logic elements enable consolidation of multiple functions onto a single device, reducing board-level BOM and interconnect complexity.
• Substantial On‑Chip Memory: Approximately 8.2 Mbits of embedded RAM lowers the need for external memory and improves data-path latency.
• Industrial Reliability: −40 °C to 100 °C operating range and surface-mount BGA package support deployment in rugged, industrial environments.
• Flexible I/O Count: 210 I/O pins provide broad interface options for sensors, peripherals, and high-pin-count subsystems.
• Standards‑Aware Family Ecosystem: Access to Cyclone III family IP and design flows helps accelerate development and system validation.

Why Choose EP3CLS200F484I7?

The EP3CLS200F484I7 positions itself as a high-capacity, industrial-grade Cyclone III FPGA suited for designs that require large programmable logic fabric, significant embedded memory, and a robust I/O complement. Its specified core voltage range and industrial temperature rating make it a practical choice for systems where power efficiency and environmental resilience are required.

Engineers targeting consolidation of complex functions, acceleration of data-paths, or implementation of advanced embedded logic will find the combination of logic density, on‑chip RAM, and Cyclone III family design resources valuable for reducing system complexity and supporting long-term scalability.

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