EP3CLS200F484I7N

The EP3CLS200F484I7N is a Cyclone® III family field-programmable gate array (FPGA) offered in a 484-ball BGA package for surface-mount applications. It combines high logic density and significant embedded memory with industrial-grade thermal range and low-voltage operation, addressing designs that require substantial on-chip logic and RAM in a compact package.

Built on the Cyclone III device family architecture, the product targets high-volume, low-power, and cost-sensitive markets while meeting industrial operating conditions. The device is suitable for applications that demand large logic capacity, multiple I/O, and integrated clock management while operating between -40 °C and 100 °C.

Key Features

• High Logic Capacity — 198,464 logic elements provide substantial on-chip programmable logic resources for complex designs.
• Embedded Memory — Approximately 8.2 Mbits of on-chip RAM for buffering, FIFOs, and embedded data storage.
• User I/O — 210 user I/Os to support wide interface requirements and board-level connectivity.
• Clock Management — Device family includes multiple phase-locked loops (PLLs) for robust clock synthesis and distribution.
• Low-Voltage Supply — Core voltage range of 1.15 V to 1.25 V to support low-power system designs.
• Industrial Temperature Grade — Rated operation from -40 °C to 100 °C for industrial environments.
• Package and Mounting — 484-BGA (484-FBGA, 23×23) package, surface-mountable for compact PCB integration.
• Regulatory — RoHS compliant, supporting environmentally responsible manufacturing.

Typical Applications

• Industrial Control — Deterministic logic capacity and industrial temperature rating make the device suitable for motion control, PLC interfaces, and factory automation systems.
• Portable and Battery-Powered Equipment — Low-voltage operation and Cyclone III family low-power characteristics help extend battery life in handheld and portable products.
• Embedded Processing and System Integration — Large logic and memory resources support integration of custom processing pipelines and embedded subsystems.
• High-Density I/O Interfaces — 210 I/Os accommodate multi-protocol front-end interfaces, bridging, and custom I/O subsystems.

Unique Advantages

• High logic-plus-memory density: 198,464 logic elements combined with approximately 8.2 Mbits of embedded memory enable consolidated system designs and reduced external memory dependency.
• Industrial-ready operation: Specified -40 °C to 100 °C operation supports deployment in thermally challenging and industrial environments.
• Low-voltage, power-aware design: Core supply range of 1.15 V–1.25 V aligns with low-power system requirements and helps minimize overall power consumption.
• Robust clocking resources: Cyclone III family clock management with multiple PLLs simplifies multi-clock-domain designs and high-speed interface timing.
• Compact, high-pin-count package: 484-FBGA (23×23) provides a balance of board-area efficiency and ample I/O for complex systems.
• Design ecosystem: Cyclone III device family support includes available pre-built IP and device-level features to accelerate design implementation and verification.

Why Choose EP3CLS200F484I7N?

The EP3CLS200F484I7N positions itself as a high-density, industrial-grade Cyclone III FPGA option for designers who need significant on-chip logic and memory in a compact BGA package. Its combination of nearly 200k logic elements, approximately 8.2 Mbits of embedded RAM, and 210 I/Os supports integration of complex functions while maintaining a low-voltage core and industrial operating range.

This device is well suited for teams building high-volume, cost-sensitive products or industrial systems that benefit from the Cyclone III device family attributes—low power operation, integrated clock resources, and a supporting ecosystem of IP and tools to streamline development and deployment.

Request a quote or submit an inquiry to check availability, lead times, and pricing for EP3CLS200F484I7N.