EP3CLS200F780C8ES

The EP3CLS200F780C8ES is a Cyclone® III family FPGA offering high logic density and on-chip memory in a 780-ball FBGA package. Designed for high-volume, low-power, cost-sensitive commercial applications, this device combines substantial programmable logic, abundant embedded RAM, and a large I/O count to support complex system integration.

As part of the Cyclone III device family, the device benefits from low-power process technology and family-level architecture features such as integrated clock management and a wide ecosystem of device-level IP and tools.

Key Features

• Logic Capacity  Provides 198,464 logic elements to implement large custom logic functions and complex combinational/sequential designs.
• Embedded Memory  Approximately 8.2 Mbits of on-chip RAM for buffering, packet storage, and state retention in FPGA-based systems.
• I/O Density  413 user I/O pins to support diverse peripheral interfaces and parallel connectivity requirements.
• Power and Voltage  Operates from a core supply range of 1.15 V to 1.25 V, aligning with low-power design objectives.
• Package and Mounting  780-ball FBGA (29 × 29 mm) surface-mount package optimized for high-pin-count applications and compact board layouts.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial applications.
• RoHS Compliant  Meets RoHS environmental requirements for lead-free assembly.
• Cyclone III Family Capabilities  Family-level features include low-power TSMC process optimizations, on-device clock management with multiple PLLs, and an ecosystem of pre-built IP and development tools.

Typical Applications

• Portable and Handheld Devices  Low-power family characteristics and compact package make the device suitable for battery-powered equipment where power efficiency is important.
• High-Volume Consumer Electronics  High logic and memory density with a cost-focused family platform supports feature-rich consumer products at scale.
• Embedded System Integration  Large I/O count and abundant embedded memory enable integration of multiple interfaces and buffering for system controllers and peripherals.
• Custom Logic and IP Acceleration  Substantial logic resources and family support for pre-built IP and embedded processing allow implementation of tailored accelerators and control logic.

Unique Advantages

• High Logic and Memory Density: 198,464 logic elements and approximately 8.2 Mbits of embedded RAM provide headroom for complex designs and large state machines.
• Extensive I/O Count: 413 user I/Os simplify interfacing to multiple peripherals and parallel buses without resorting to external multiplexing.
• Low-Power Family Technology: Based on low-power process technology, the Cyclone III family helps minimize static power consumption for thermally constrained designs.
• Compact High-Pin Package: The 780-FBGA (29 × 29) package balances high pin count with compact PCB footprint for dense system layouts.
• Commercial Temperature Range: Rated 0 °C to 85 °C to match typical commercial product requirements.
• Environmentally Compliant: RoHS compliance supports lead-free manufacturing and regulatory requirements for many markets.

Why Choose EP3CLS200F780C8ES?

The EP3CLS200F780C8ES delivers a combination of large programmable logic capacity, significant on-chip memory, and a high I/O count in a compact 780-ball FBGA package—making it well suited for commercial, high-volume, and power-conscious designs that require substantial integration. As part of the Cyclone III family, it benefits from low-power process technology and a device-level ecosystem of development tools and IP to accelerate time-to-market.

This device is ideal for designers who need scalable logic resources, abundant embedded memory, and flexible I/O in a cost-focused FPGA platform supported by Cyclone III family documentation and IP resources.

Request a quote or submit a procurement inquiry to check pricing and availability for the EP3CLS200F780C8ES and to discuss how it fits your next design.