EP3CLS200F780I7N

The EP3CLS200F780I7N is a Cyclone® III FPGA offering a high-density, low-power programmable logic fabric for cost- and power-sensitive designs. This device integrates 198,464 logic elements with approximately 8.2 Mbits of embedded memory and 413 user I/Os to support complex logic, memory, and interface functions on a single 780‑BGA package.

Targeted at industrial applications, the device runs from a 1.15 V to 1.25 V core supply and supports operation from −40 °C to 100 °C, making it suitable for thermally and environmentally demanding systems that require robust integration and sustained performance.

Key Features

• Logic Capacity  198,464 logic elements provide large-scale programmable logic to implement wide-ranging digital functions.
• Embedded Memory  Approximately 8.2 Mbits of on-chip RAM for data buffering, FIFOs, and tightly coupled memory structures.
• I/O Resources  413 user I/Os to support multiple parallel interfaces, board-level connectivity, and mixed-signal front ends.
• Clock Management  Family documentation specifies four phase-locked loops (PLLs) per device for flexible clock synthesis and distribution.
• Low-Voltage Core  Core supply range of 1.15 V to 1.25 V to align with low-power system budgets.
• Package & Mounting  780‑BGA (supplier package: 780‑FBGA, 29×29) in a surface-mount form factor to support high-density PCB layouts.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Regulatory  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Industrial Control  Programmable logic and abundant I/O support motor control, I/O aggregation, and protocol bridging in factory and process automation systems.
• Communications Infrastructure  High logic density and on-chip memory enable packet buffering, protocol processing, and custom datapath implementation in network appliances.
• Embedded Systems  Large logic fabric and memory support system integration tasks such as custom accelerators, signal conditioning, and embedded processing integration.
• Low‑Power, High‑Volume Products  Low-voltage core and family-level low-power optimizations make the device suitable for cost-sensitive, power-constrained consumer or portable products.

Unique Advantages

• High integration in a single package: Combines nearly 200k logic elements, substantial embedded memory, and 413 I/Os to reduce BOM and board area.
• Design scalability: Family-level architectural features and large resource counts support complex designs and future feature growth without changing device architecture.
• Industrial-temperature reliability: −40 °C to 100 °C operating range supports deployment in harsher environments common to industrial applications.
• Flexible clocking: Multiple PLLs per device provide flexible clock synthesis and distribution to simplify timing architectures.
• Package options for dense PCBs: 780‑BGA (780‑FBGA, 29×29) surface-mount package enables compact, high-density board designs.
• Regulatory compliance: RoHS compliance supports eco-conscious manufacturing and global market requirements.

Why Choose EP3CLS200F780I7N?

The EP3CLS200F780I7N positions itself as a high-capacity, low-power Cyclone III FPGA that brings together significant programmable logic, embedded memory, and a large complement of I/Os in a single industrial-temperature BGA package. Its combination of resources and family-level features supports integration of complex digital functions while helping reduce board-level component count and system power.

This device is well suited to engineers and product teams building industrial control systems, communications equipment, and embedded platforms that require scalable logic capacity, robust thermal performance, and compact packaging within a RoHS-compliant solution.

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