EP3CLS70F484C7N

The EP3CLS70F484C7N is a Cyclone III family FPGA in a 484-ball BGA package designed for high-volume, low-power, cost-sensitive applications. This device delivers a substantial logic capacity and on-chip memory within a compact surface-mount 484-FBGA (23×23) package.

With 70,208 logic elements, approximately 3.07 Mbits of embedded memory, and 278 I/Os, the device provides a balanced mix of logic, memory, and connectivity for embedded systems, portable electronics, and general-purpose programmable logic designs. It operates from a core supply of 1.15 V to 1.25 V and is specified for commercial temperature operation (0 °C to 85 °C). The part is RoHS compliant.

Key Features

• Logic Capacity — 70,208 logic elements for implementing medium-to-high complexity digital logic and control functions.
• Embedded Memory — Approximately 3.07 Mbits of on-chip RAM to support buffering, data storage, and embedded-memory-centric algorithms.
• I/O Count and Package — 278 user I/Os in a 484-BGA (484-FBGA, 23×23) surface-mount package to support dense external interfacing and compact board layouts.
• Power Supply — Core voltage range 1.15 V to 1.25 V, enabling compatibility with low-voltage system power rails.
• Commercial Temperature Grade — Specified for 0 °C to 85 °C operation for standard commercial deployments.
• RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing and regulatory compliance.
• Cyclone III Family Capabilities — Family-level features include low-power silicon optimizations, on-chip clock management (PLL support), and an available ecosystem of development tools and IP cores to accelerate design.
• Surface Mount — Designed for standard SMT assembly in high-volume production.

Typical Applications

• Battery-powered and portable devices — Low-power Cyclone III family characteristics help extend battery life and reduce cooling needs in handheld designs.
• Consumer and industrial control — Use for motor control, user-interface logic, and general-purpose control functions where medium-density logic and plentiful I/O are required.
• Embedded systems and prototyping — On-chip RAM and logic capacity enable system integration, peripheral control, and custom processing tasks.

Unique Advantages

• High logic density — 70,208 logic elements provide the capacity to consolidate multiple functions onto a single FPGA, reducing board-level BOM and interconnect complexity.
• Substantial on-chip memory — Approximately 3.07 Mbits of embedded RAM supports larger buffering and data-path implementations without relying on external memory.
• Extensive I/O in a compact package — 278 I/Os in a 484-FBGA (23×23) package facilitate rich external connectivity while maintaining a small PCB footprint.
• Low-voltage core operation — 1.15 V to 1.25 V core supply aligns with modern low-power system rails for efficient power architectures.
• Commercial temperature rating — Specified 0 °C to 85 °C operation for standard commercial deployments and environments.
• RoHS compliance — Meets lead-free manufacturing requirements for global production.

Why Choose EP3CLS70F484C7N?

The EP3CLS70F484C7N positions itself as a practical, cost-conscious FPGA option for designs that need substantial logic capacity, on-chip memory, and a high I/O count in a compact surface-mount package. It is well suited to designers targeting high-volume, power-sensitive applications where integration and board-space efficiency matter.

Backed by the Cyclone III device family capabilities and ecosystem, this part offers a balance of performance, integration, and manufacturability for embedded system designers and OEMs seeking scalable FPGA resources with the support of established development tools and IP.

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