EP3CLS200F780C8N

The EP3CLS200F780C8N is a Cyclone® III family Field Programmable Gate Array (FPGA) provided in a 780-ball FBGA (29×29) surface-mount package. It delivers a high-density programmable fabric with 198,464 logic elements, approximately 8.21 Mbits of embedded memory, and 413 user I/Os, targeting cost-sensitive, low-power embedded designs.

Built on the Cyclone III device family architecture, this device is optimized for low power and high integration with features such as multiple PLLs and broad I/O capability, making it suitable for portable and high-volume applications that require solid performance within a commercial operating range.

Key Features

• Logic Capacity — 198,464 logic elements to implement large-scale, highly parallel logic and control functions.
• On-chip Memory — Approximately 8.21 Mbits of embedded memory for packet buffering, lookup tables, and state storage.
• I/O Count — 413 user I/Os to support dense external interfaces and multi-channel connectivity.
• Power Supply — Core voltage range of 1.15 V to 1.25 V to match platform power budgeting requirements.
• Package & Mounting — 780-FBGA (29×29) package, surface-mount for compact board-level integration.
• Operating Range — Commercial-grade operation from 0 °C to 85 °C for mainstream embedded applications.
• Low-Power Family Technologies — Cyclone III family features TSMC low-power process and power-aware design flow to minimize static and dynamic power.
• Clock Management — Multiple phase-locked loops (PLLs) per device provide flexible clock synthesis and distribution for complex systems.
• RoHS Compliance — Meets environmental requirements for lead-free assembly and compliance-driven designs.

Typical Applications

• Portable and Handheld Devices — Low-power Cyclone III family technologies help extend battery life for portable instruments and consumer handhelds.
• Embedded Control and Processing — Large logic capacity and on-chip memory enable complex control, signal processing, and soft-core processor implementations.
• High-Density I/O Systems — 413 user I/Os suit multi-channel interfaces, mid-range data aggregation, and peripheral-rich boards.
• Cost-Sensitive, High-Volume Products — The Cyclone III family’s balance of integration and low power addresses high-volume applications where BOM and power are key constraints.

Unique Advantages

• Highly Integrated Fabric: Combines nearly 200k logic elements with sizeable embedded memory and many I/Os to reduce external components and simplify board design.
• Power-Aware Design: Family-level low-power process and design flows reduce static power consumption, benefiting thermally constrained and battery-operated systems.
• Flexible Clocking: Multiple PLLs per device offer robust clock management for diverse timing domains and high-performance I/O interfaces.
• Commercial-Ready Operation: Rated for 0 °C to 85 °C and available in a compact 780-FBGA package for mainstream embedded products.
• Design Ecosystem: Cyclone III device family support includes pre-built IP and design flows to accelerate development and field updates.
• Regulatory Compatibility: RoHS-compliant materials support lead-free manufacturing and compliance initiatives.

Why Choose EP3CLS200F780C8N?

The EP3CLS200F780C8N positions itself as a high-density, commercially rated Cyclone III FPGA option for designers who need substantial logic capacity, significant embedded memory, and a large number of I/Os in a compact FBGA package. Its family-level low-power characteristics and clocking flexibility make it suitable for embedded systems and high-volume applications where power, integration, and predictable operating ranges matter.

For teams targeting scalable designs with access to Cyclone III family IP and tool support, this device delivers a balance of performance, integration, and manufacturability that supports reliable product deployment across commercial embedded markets.

Request a quote or submit an inquiry to get pricing and availability for EP3CLS200F780C8N and start integrating this Cyclone III FPGA into your next embedded design.