EP3CLS200F780C7N

The EP3CLS200F780C7N is a Cyclone® III field-programmable gate array (FPGA) offered in a 780-ball BGA package. It delivers a large fabric with 198,464 logic elements and approximately 8.21 Mbits of embedded memory, targeting high‑integration, cost‑sensitive commercial applications where power and I/O density matter.

Designed as part of the Cyclone III device family, this device combines substantial logic and memory resources with a high I/O count and low-power operation, making it suitable for portable, handheld, and other commercially graded systems operating from 0 °C to 85 °C.

Key Features

• High-density logic — 198,464 logic elements to implement complex digital functions and large custom logic subsystems.
• Embedded memory — Approximately 8.21 Mbits of on-chip RAM to support buffers, FIFOs, and architecture-local storage without external memory.
• Extensive I/O — 413 user I/O pins to support multiple interfaces and high pin-count system connections.
• Low-power Cyclone III architecture — Family-level low-power optimizations and TSMC low-power process technology designed to minimize static power consumption (family reference: less than ¼ watt static power under typical Cyclone III conditions).
• Clock management — Cyclone III family provides multiple PLLs (four PLLs per device, five outputs per PLL) for robust clock synthesis and distribution; PLLs are cascaded and dynamically reconfigurable at the family level.
• Secure-family options — Cyclone III family documentation describes LS variants with integrated security features (encryption, design separation) for designs that require those capabilities.
• Package and mounting — 780‑BGA (supplier package: 780‑FBGA, 29 × 29 mm) for dense board-level integration; surface-mount package optimized for system assembly.
• Voltage and temperature — Core supply range 1.15 V to 1.25 V; commercial operating range from 0 °C to 85 °C.
• RoHS compliant — Meets RoHS environmental requirements for lead‑free assembly.

Typical Applications

• Portable and handheld systems — Low-power Cyclone III architecture supports extended battery life and reduced cooling needs in compact products.
• High‑integration consumer electronics — Large logic and memory resources plus high I/O count enable feature-rich consumer devices with consolidated system functions.
• Communications and networking — Dense logic and abundant I/O accommodate protocol handling, packet buffering, and custom interface logic in commercial network equipment.
• Embedded processing solutions — On-chip memory and fabric capacity support soft-core processors and application-specific accelerators for a wide range of embedded tasks.

Unique Advantages

• Large fabric capacity: 198,464 logic elements let you implement complex, multi‑function designs on a single device to reduce BOM and board area.
• Significant on‑chip memory: Approximately 8.21 Mbits of embedded RAM reduces reliance on external memory and simplifies memory subsystem design.
• High I/O count: 413 I/O pins enable broad interface support and flexible board-level partitioning without needing multiple devices.
• Low-power family characteristics: Cyclone III family optimizations and process technology help control static power, supporting thermally constrained designs.
• Robust clocking: Family-level PLL resources (four PLLs, five outputs each) facilitate complex clock domains and low-jitter distribution for timing-critical systems.
• Commercial-grade availability: Designed for 0 °C to 85 °C operation and RoHS compliance to match commercial product deployment requirements.

Why Choose EP3CLS200F780C7N?

The EP3CLS200F780C7N positions itself as a high‑capacity, commercially graded FPGA option for designs that demand large logic and embedded memory resources while maintaining attention to power and board-level integration. With nearly 200k logic elements, over 8 Mbits of on‑chip RAM, and 413 I/Os in a 780‑BGA footprint, it supports consolidation of system functions into a single FPGA to reduce component count and simplify PCB routing.

Choose this Cyclone III FPGA when you need scalable logic density, significant embedded memory, and comprehensive I/O in a RoHS‑compliant, surface‑mount package for commercial applications operating within the 0 °C to 85 °C range.

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