EP3CLS200F780C8

The EP3CLS200F780C8 is a Cyclone® III family FPGA offering high logic capacity and dense embedded memory in a compact 780‑FBGA (29×29) surface‑mount package. Built on a low‑power TSMC process and designed for high‑volume, cost‑sensitive applications, this device delivers approximately 198,464 logic elements and approximately 8.21 Mbits of on‑chip RAM with 413 user I/Os.

This commercial‑grade device operates from a core supply of 1.15 V to 1.25 V and is specified for 0 °C to 85 °C, providing a balance of performance, integration, and power efficiency for consumer, portable, and embedded system designs.

Key Features

• Core and Logic  Approximately 198,464 logic elements provide substantial programmable logic capacity for complex designs and system integration.
• Embedded Memory  Approximately 8.21 Mbits of total RAM bits enables large on‑chip data buffering, frame storage, and state retention for high‑throughput designs.
• I/O and Interfaces  413 user I/Os support a wide range of peripheral and interface signals; family documentation notes support for multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI‑X, LVPECL, BLVDS, LVDS, mini‑LVDS, RSDS, PPDS).
• Clocking and Timing  Cyclone III family devices include up to four PLLs per device with five outputs per PLL, enabling flexible clock management and synthesis for complex timing requirements.
• Power and Voltage  Designed on a low‑power process with a core voltage supply range of 1.15 V to 1.25 V to support energy‑efficient operation in power‑sensitive applications.
• Package and Mounting  780‑BGA (780‑FBGA, 29×29) surface‑mount package delivers high pin count in a compact footprint for space‑constrained PCBs.
• Operating Range and Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C suitable for mainstream consumer and embedded products.
• Compliance  RoHS compliant.

Typical Applications

• Portable and Handheld Devices  Low‑power process technology and substantial on‑chip memory help extend battery life and reduce reliance on external memory in portable designs.
• Embedded Control and Processing  Large logic capacity and support for the Nios® II embedded processor (Cyclone III family) enable custom embedded processing, protocol handling, and control functions.
• Communications and Networking  High I/O count and flexible clocking (multiple PLLs) support complex interface logic, timing domains, and high‑speed data paths common in networking equipment.
• High‑volume, Cost‑sensitive Products  Family positioning emphasizes low cost and low power for designs targeted at large production runs and tight BOM budgets.

Unique Advantages

• Highly integrated solution: Combines large logic fabric with approximately 8.21 Mbits of embedded RAM to reduce the need for external components and simplify PCB design.
• Low‑power architecture: TSMC low‑power process and Cyclone III power‑aware features help lower static power consumption and extend battery life in portable systems.
• Flexible I/O and clocking: 413 I/Os and multiple PLLs with multiple outputs per PLL enable flexible interface support and robust clock domain management.
• Compact, high‑pin package: 780‑FBGA (29×29) delivers high I/O density in a compact surface‑mount footprint for space‑constrained designs.
• Commercial readiness: Commercial temperature grade (0 °C to 85 °C) and RoHS compliance make the device suitable for mainstream consumer and embedded applications.
• Design ecosystem: Cyclone III family resources include a wide collection of pre‑built and verified IP cores and support for the Nios II embedded processor to accelerate development.

Why Choose EP3CLS200F780C8?

EP3CLS200F780C8 positions itself for designs that require very high logic capacity and on‑chip memory while maintaining low power and compact packaging. Its combination of approximately 198,464 logic elements, approximately 8.21 Mbits of embedded RAM, 413 I/Os, and advanced clocking options makes it well suited for consumer, portable, and embedded applications where integration and power efficiency are priorities.

Backed by the Cyclone III family ecosystem—documented family features, pre‑verified IP, and embedded processor support—this device offers a practical platform for scaling from prototype to high‑volume production without sacrificing integration or design flexibility.

Request a quote or submit a pricing inquiry for EP3CLS200F780C8 to evaluate suitability for your next design.