EP3CLS200F780I7

The EP3CLS200F780I7 is an Intel Cyclone III family field-programmable gate array supplied in a 780-ball BGA. It delivers high functional density (198,464 logic elements) and substantial embedded memory for designs that require integration, configurable logic capacity, and industrial-temperature operation.

Designed for low-power, cost-sensitive implementations, this device is suitable for high-volume and thermally constrained systems where a balance of logic resources, I/O count, and system integration is required.

Key Features

• Logic Capacity  Approximately 198,464 logic elements providing large programmable logic resources for complex designs.
• Logic Array Blocks  12,404 LABs (logic array blocks) for structured logic partitioning and design mapping.
• Embedded Memory  Approximately 8.2 Mbits of embedded memory (8,211,456 bits) for on-chip data storage and buffering.
• I/O  413 user I/O pins to support diverse interfaces and external peripherals.
• Clock Management  Four phase-locked loops (PLLs) per device (family feature) for flexible clock synthesis and distribution.
• Power  Low-power Cyclone III family architecture optimized for reduced static power; core voltage supply range 1.15 V to 1.25 V.
• Package & Mounting  780-BGA package, supplier device package 780-FBGA (29×29), surface-mount for compact board integration.
• Operating Range & Grade  Industrial grade operation from −40°C to 100°C for deployment in extended-temperature environments.
• Standards & Integration (Family)  Cyclone III family supports a wide set of I/O standards and system integration features, plus a suite of design IP and embedded processing options.
• RoHS Compliance  RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• Industrial Control systems  Use the device’s industrial temperature rating and large logic/memory resources for motor control, real-time processing, and factory automation tasks.
• Communications & Networking  High I/O count and flexible clocking make it suitable for protocol bridging, packet processing, and interface adaptation.
• Embedded Processing  Leverage on-chip memory and family support for embedded processors and custom logic acceleration in instrumentation or test equipment.
• Imaging & Signal Processing  Large logic resource and embedded RAM enable data buffering and parallel processing functions for video and sensor interfaces.

Unique Advantages

• High integration density: Large logic element count and multiple LABs help consolidate functions that would otherwise require multiple devices.
• Substantial on-chip memory: Approximately 8.2 Mbits of embedded RAM reduces external memory dependence and simplifies PCB design.
• Flexible I/O and clocking: 413 I/Os and four PLLs per device (family feature) enable diverse interface support and robust timing architectures.
• Low-power family architecture: Cyclone III family optimizations and low-power process technology help meet tight power budgets in portable or thermally constrained designs.
• Industrial-ready operation: Specified for −40°C to 100°C operation and supplied in a compact 780-FBGA package for space-constrained, rugged designs.
• Designed for system integration: Family-level IP, embedded processor support, and clock-management features accelerate time-to-market and reduce design complexity.

Why Choose EP3CLS200F780I7?

The EP3CLS200F780I7 positions itself as a high-capacity Cyclone III FPGA option for designs that require a large pool of programmable logic, significant on-chip memory, and a high I/O count within an industrial temperature envelope. Its combination of logic density, embedded RAM, and system-level features from the Cyclone III family addresses integration and power-efficiency needs in volume-focused applications.

Engineers targeting scalable, robust designs will benefit from the device’s resources and the broader Cyclone III ecosystem of IP and development flow—providing a practical platform for consolidating functions, simplifying board design, and accelerating development.

Request a quote or submit an inquiry to receive pricing and availability for EP3CLS200F780I7 and to discuss how this FPGA can fit your next design.